The Materials Characterization Facility (MCF) at Georgia Tech has installed a new inorganic m spectrometry facility. The facility includes two new inductively couple plasma mass spectrometry (ICP-MS) systems: a Thermo iCAP RQ quadrupole ICP-MS for streamlined and high-throughput determinations of elemental concentrations and a Thermo Neoma multicollector ICP-MS with collision cell technology for the precise determinations of isotope ratios within a given sample.

Each instrument can measure elemental variability in both dissolved aqueous samples as well as solids/minerals via laser ablation microsampling from a Teledyne Iridia laser ablation system. Together the system can measure isotopes at precision in elemental systems from Li and U.

Planned applications include: (1) high-resolution measurements of Ca, Sr, Ba, Mg, and B elemental and isotopic variability in seawater and marine and terrestrial carbonates for paleoclimate reconstructions, (2) (U-Th)/Pb dating and Hf isotope measurements to study the origin of critical mineral deposits, with a potential engineering application and the development of novel methods for increasing precision/accuracy and minimizing sample consumption during routine analyses of water quality and environmental contamination.

The MCF welcomes users interested in these and other potential applications of this new facility to their scientific and engineering research to contact David Tavakoli (atavakoli6@gatech.edu).

A team of researchers at the University of Massachusetts Amherst and the Georgia Institute of Technology has 3D printed a dual-phase, nanostructured high-entropy alloy that exceeds the strength and ductility of other state-of-the-art additively manufactured materials, which could lead to higher-performance components for applications in aerospace, medicine, energy and transportation. The research, led by Wen Chen, assistant professor of mechanical and industrial engineering at UMass, and Ting Zhu, professor of mechanical engineering at Georgia Tech, was published in the August issue of the journal Nature.

Over the past 15 years, high entropy alloys (HEAs) have become increasingly popular as a new paradigm in materials science. Comprised of five or more elements in near-equal proportions, they offer the ability to create a near-infinite number of unique combinations for alloy design. Traditional alloys, such as brass, carbon steel, stainless steel and bronze, contain a primary element combined with one or more trace elements.

Additive manufacturing, also called 3D printing, has recently emerged as a powerful approach of material development. The laser-based 3D printing can produce large temperature gradients and high cooling rates that are not readily accessible by conventional routes. However, “the potential of harnessing the combined benefits of additive manufacturing and HEAs for achieving novel properties remains largely unexplored,” says Zhu.

Chen and his team in the Multiscale Materials and Manufacturing Laboratory combined an HEA with a state-of-the-art 3D printing technique called laser powder bed fusion to develop new materials with unprecedented properties. Because the process causes materials to melt and solidify very rapidly as compared to traditional metallurgy, “you get a very different microstructure that is far-from-equilibrium” on the components created, Chen says. This microstructure looks like a net and is made of alternating layers known as face-centered cubic (FCC) and body-centered cubic (BCC) nanolamellar structures embedded in microscale eutectic colonies with random orientations. The hierarchical nanostructured HEA enables co-operative deformation of the two phases.

“This unusual microstructure’s atomic rearrangement gives rise to ultrahigh strength as well as enhanced ductility, which is uncommon, because usually strong materials tend to be brittle,” Chen says. Compared to conventional metal casting, “we got almost triple the strength and not only didn’t lose ductility, but actually increased it simultaneously,” he says. “For many applications, a combination of strength and ductility is key. Our findings are original and exciting for materials science and engineering alike.”

“The ability to produce strong and ductile HEAs means that these 3D printed materials are more robust in resisting applied deformation, which is important for lightweight structural design for enhanced mechanical efficiency and energy saving,” says Jie Ren, Chen’s Ph.D. student and first author of the paper.

Zhu’s group at Georgia Tech led the computational modeling for the research. He developed dual-phase crystal plasticity computational models to understand the mechanistic roles played by both the FCC and BCC nanolamellae and how they work together to give the material added strength and ductility. 

“Our simulation results show the surprisingly high strength yet high hardening responses in the BCC nanolamellae, which are pivotal for achieving the outstanding strength-ductility synergy of our alloy. This mechanistic understanding provides an important basis for guiding the future development of 3D printed HEAs with exceptional mechanical properties,” Zhu says.

In addition, 3D printing offers a powerful tool to make geometrically complex and customized parts. In the future, harnessing 3D printing technology and the vast alloy design space of HEAs opens ample opportunities for the direct production of end-use components for biomedical and aerospace applications.

Additional research partners on the paper include Texas A&M University, the University of California Los Angeles, Rice University, and Oak Ridge and Lawrence Livermore national laboratories.

Story by Melinda Rose, Associate News Editor at UMass Amherst. 

By Frida Carrera

 

On Wednesday, April 13th 2022, the Undergraduate Research Opportunities Program (UROP) hosted the 16th annual Spring Undergraduate Research Symposium. UROP’s annual symposium is Georgia Tech’s largest undergraduate research colloquium and allows students to present their research and gain valuable skills and presentation experience. Each year the symposium also presents awards to the top poster and oral presentation from each college and honors the Outstanding Undergraduate Researcher (OUR) from each college. And with over 40 oral presentations and nearly 90 poster presentations, this year’s symposium proved to be another success for UROP and Georgia Tech.  

This year the symposium was held in Exhibition Hall and opened with an introduction and keynote address to students, faculty, and other non-presenters. Shortly after, the event moved into the poster presentations segment where undergraduate students displayed their research to judges, faculty, and other attendees. The oral presentations followed soon after and gave student researchers the opportunity to go more in-depth with their research and findings and answer any questions the judges and attendees had. To end the event, sponsoring colleges and departments recognized Outstanding Undergraduate Researchers from their respective colleges. Additionally, the symposium judges were tasked with selecting the top student researchers having exceptional poster and oral presentations. 

Any Georgia Tech undergraduate student interested in presenting their research is encouraged to apply for future symposiums and to build on research presentation skills, connect with other undergraduate researchers and faculty, and the chance to be recognized with awards by members of the Georgia Tech research community. UROP also hosts other research-related events and workshops throughout the school year to assist undergraduate students interested in research and build on their passions! 

To view the list of awardees and pictures from the event visit: https://symposium.urop.gatech.edu/awards/ 

To learn more about undergraduate research at Georgia Tech visit: https://urop.gatech.edu/

ECE Ph.D. student Nujhat Tasneem has won the Ed Nicollian Award for best student paper at the Institute of Electrical and Electronics Engineers (IEEE) Semiconductor Interface Specialist Conference (SISC). The event was held in early December 2021 with awards being announced in March 2022.

Tasneem’s presentation, “Charge Trapping Effects on Memory Window in Ferroelectric Field Effect Transistors,” was the highest rated presentation based on the feedback of SISC committee members and invited speakers. She is the first Georgia Tech student to receive the award.

The award-winning paper introduced a novel electrical characterization method to track carrier capture and emission dynamics during write operations in n-type ferroelectric-field-effect transistors (FEFETs). FEFETs are a candidate for high-density, non-volatile, embedded memory applications due to their promise of having low operating voltages and write energies combined with low-leakage, and high-density integration. While significant work has been done to explain the operation and endurance of FEFETs, this research details a superior method of measurement because it provides an understanding of the transport and the status of the ferroelectric.

“This novel characterization method sheds a light on the underlying device physics of FEFETs, which is necessary to optimize its design, especially as a non-volatile memory (NVM) element” said Tasneem.

Tasneem is currently part of the The Khan Lab headed by ECE Assistant Professor Asif Khan. The work presented was supported by the ASCENT project (Applications and Systems-driven Center for Energy-Efficient integrated Nano Technologies), one of six centers supported by SRC’s Joint University Microelectronics Program (JUMP). Fabrication at Tech was done at the Institute for Electronics and Nanotechnology (IEN), supported by the National Science Foundation- National Nanotechnology Coordinated Infrastructure (NSF-NNCI) program.

The SISC Ed Nicollian Award for best student paper was established in 1995 in honor of Professor E.H. Nicollian, University of North Carolina at Charlotte. Nicollian was a pioneer in the exploration of the metal-oxide-semiconductor system, particularly in the area of electrical measurements. His efforts were fundamental to establishing the SISC in its early years.

5G+ (5G/Beyond 5G) is the fastest-growing segment and the only significant opportunity for investment growth in the wireless network infrastructure market, according to the latest forecast by Gartner, Inc. But currently 5G+ technologies rely on large antenna arrays that are typically bulky and come only in very limited sizes, making them difficult to transport and expensive to customize.

Researchers from Georgia Tech’s College of Engineering have developed a novel and flexible solution to address the problem. Their additively manufactured tile-based approach can construct on-demand, massively scalable arrays of 5G+ (5G/Beyond 5G)‐enabled smart skins with the potential to enable intelligence on nearly any surface or object. The study, recently published in Scientific Reports, describes the approach, which is not only much easier to scale and customize than current practices, but features no performance degradation whenever flexed or scaled to a very large number of tiles.

“Typically, there are a lot of smaller wireless network systems working together, but they are not scalable. With the current techniques, you can’t increase, decrease, or direct bandwidth, especially for very large areas,” said Manos Tentzeris, Ken Byers Professor in Flexible Electronics in the School of Electrical and Computer Engineering. “Being able to utilize and scale this novel tile-based approach makes this possible.”

Tentzeris says his team’s modular application equipped with 5G+ capability has the potential for immediate, large-scale impact as the telecommunications industry continues to rapidly transition to standards for faster, higher capacity, and lower latency communications.

BUILDING THE TILES

In Georgia Tech’s new approach, flexible and additively manufactured tiles are assembled onto a single, flexible underlying layer. This allows tile arrays to be attached to a multitude of surfaces. The architecture also allows for very large 5G+ phased/electronically steerable antenna array networks to be installed on-the-fly. According to Tentzeris, attaching a tile array to an unmanned aerial vehicle (UAV) is even a possibility to surge broadband capacity in low coverage areas.

In the study, the team fabricated a proof-of-concept, flexible 5×5-centimeter tile array and wrapped it around a 3.5-centimeter radius curvature. Each tile includes an antenna subarray and an integrated, beamforming integrated circuit on an underlying tiling layer to create a smart skin that can seamlessly interconnect the tiles into very large antenna arrays and massive multiple-input multiple-outputs (MIMOs) — the practice of housing two or more antennas within a single wireless device. Tile-based array architectures on rigid surfaces with single antenna elements have been researched before, but do not include the modularity, additive manufacturability, or flexible implementation of the Georgia Tech design.

The proposed modular tile approach means tiles of identical sizes can be manufactured in large quantities and are easily replaceable, reducing the cost of customization and repairs. Essentially, this approach combines removable elements, modularity, massive scalability, low cost, and flexibility into one system.

5G+ IS JUST THE BEGINNING

While the tiling architecture has demonstrated the ability to greatly enhance 5G+ technologies, its combination of flexible and conformal capabilities has the potential to be applied in numerous different environments, the Georgia Tech team says.

“The shape and features of each tile scale can be singular and can accommodate different frequency bands and power levels,” said Tentzeris. “One could have communications capabilities, another sensing capabilities, and another could be an energy harvester tile for solar, thermal, or ambient RF energy. The application of the tile framework is not limited to communications.”

Internet of Things, virtual reality, as well as smart manufacturing/Industry 4.0 — a technology-driven approach that utilizes internet-connected “intelligent” machinery to monitor and fully automate the production process — are additional areas of application the team is excited to explore.

“The tile-architecture’s mass scalability makes its applications particularly diverse and virtually ubiquitous. From structures the size of dams and buildings, to machinery or cars, down to individual health-monitoring wearables,” said Tentzeris. “We’re moving in a direction where everything will be covered in some type of a wireless conformal smart skin encompassing electronically steerable antenna arrays of widely diverse sizes that will allow for effective monitoring.”

The team now looks forward to testing the approach outside the lab on large, real-world structures. They are currently working on the fabrication of much larger, fully inkjet-printed tile arrays (256+ elements) that will be presented at the upcoming International Microwave Symposium (IEEE IMS 2022) – the flagship IEEE conference in RF and microwave engineering. The IMS presentation will introduce a new tile-based large-area architecture version that will allow assembly of customizable tile arrays in a rapid and low-cost fashion for numerous conformal platforms and 5G+ enabled applications.

****

The authors declare no competing interests.

This work was supported in part by the National Science Foundation.

CITATIONS: He, X., Cui, Y. & Tentzeris, M.M. Tile-based massively scalable MIMO and phased arrays for 5G/B5G-enabled smart skins and reconfigurable intelligent surfaces. Sci Rep 12, 2741 (2022). https://doi.org/10.1038/s41598-022-06096-9

K.Hu, G.S.V.Angulo, Y.Cui and M.M.Tentzeris, “Flexible and Scalable Additively Manufactured Tile-Based Phased Arrays for Satellite Communications and 5G mmWave Applications,” accepted for presentation at IEEE International Microwave Symposium (IMS) 2022, Denver, CO, June 2022.

By Frida Carrera

 

During the summer of 2021, computer science student Neil Sanghavi and computer science recent grad Ahan Shah, both from Fairfax, VA, reconnected to catch up with one another and discuss the projects they were working on. In doing so they discovered a mutual resolve to create something using innovative technology and solve a problem relating to intellectual property, specifically patents. Both Neil and Ahan had just started to get into crypto trading and realized that NFT technology had more to offer than its collectible aspect. Here the idea of PatentX was created: to use NFT technology to provide utility in an antiquated space that lacked efficiency.

“It is estimated that we have $1 trillion in unused IP in the United States currently. Additionally, it is reported that there is $25.6 billion worth of patent monetization available today. This is why we created PatentX, a blockchain-backed marketplace to facilitate intellectual property transactions. We built this to make sure the little man innovators and entrepreneurs have an outlet to monetize and connect their patents with the world. Not only that, we are creating tools for large businesses, law firms, venture capitals to manage all of their IP on the blockchain that can handle transactions in seconds.”

Neil and Ahan describe their product launch process as a great learning experience and are firm believers that there can never be too much help. They are currently supported by DXPartners and have received help from various mentors and blockchain professionals. They have been able to traverse obstacles and learn about the marketing, finance, and business aspects behind building a startup despite coming from a technical background. 

Their vision for PatentX is to disrupt the traditional way intellectual property is being transacted and to become the World’s Next Web3 Patent Office. PatentX will be releasing an NFT collection of the most historic patent innovations this early March and encourage interested individuals to stay tuned for their launch. 

 

To learn more about PatentX visit their social media: 

Twitter: @PatentXNFT

Instagram: @PatentX.io

 

To learn more about student innovation at Georgia Tech visit: https://innovation.cae.gatech.edu/

 

 

By Frida Carrera

 

On April 2, 2022, Team carSEAL will represent Georgia Tech in the 6^th annual ACC InVenture Prize Competition hosted this year by Florida State University. Team members Shovan Bhatia, Joshua Cruz, Nicholas Lima, Derek Prusener, and Giancarlo Riccobono will compete against other teams in the ACC Conference for a chance to win up to $30,000 in prizes. 

carSEAL began with five biomedical engineering students collaborating on a capstone project. After being accepted into the highly sought-after Mayo Clinic Capstone Project, they received mentorship from Dr. Rabih Tawk, a world-renowned neurosurgeon. With his guidance, they learned that surgeons currently lack the tools to close the carotid artery after endovascular procedures. Through a pragmatic approach, the team developed 100+ conceptual designs and iterations. After numerous discussions with attending surgeons across the nation and preliminary testing, they developed carSEAL – a vascular closure device for the carotid artery. 

So far, the team has found the InVenture Prize process to be exhilarating.

“Through each round of this process, we have seen incredible teams working on impactful projects and it is exciting to be surrounded by such brilliant minds from numerous backgrounds. It has been especially rewarding working with so many supportive advisors from Georgia Tech, who have been through the startup process and have freely offered their expertise. Along each step of this process, we have learned something new to refine our pitch and ensure we are presenting our most competitive self at the ACC.”

Currently, aside from preparing for the ACC InVenture Prize, the carSEAL team is performing benchtop lab testing to evaluate its efficacy in animal models. Soon after, the team will be moving to pre-clinical studies on their path to obtaining FDA clearance before carSEAL is commercialized. Winning the ACC InVenture Prize would help them gain more traction and gather sufficient funds to help them with this process.

“I am extremely proud of our team’s achievements in the short 6 months that we have worked together. carSEAL has gained a lot of traction already and we are excited to see how far we can take this, hopefully bringing carSEAL to clinical practice within a few years,” Bhatia stated.

The Georgia Tech community can support carSEAL in the competition by voting for them for the People’s Choice Awards by visiting: https://accinventureprize.com/peoples-choice-voting. Online voting begins March 28.

To learn more about the ACC InVenture Prize visit https://accinventureprize.com.

By Frida Carrera

After almost a year of preparation, practice, and refinement, Georgia Tech’s annual InVenture Prize is down to six finalists competing in the final round on March 16^th. In this televised round, the final teams will pitch their inventions to a panel of judges and compete for the top prize of $20,000, assistance in patent-filing, and a spot in CREATE-X’s Startup Launch program.

In its 14^th year, the InVenture Prize competition features different innovations created by Georgia Tech students from all disciplines and backgrounds. For months prior to the final round, the finalists received coaching and assistance from mentors and coaches on building their prototypes, developing business models, and rehearsing their pitches to investors. The final six teams were chosen from previous preliminary and semifinal rounds that included a broad range of competitors. 

The finals of the InVenture Prize will air live from Georgia Tech’s Ferst Center for the Arts at 7:30 p.m. on March 16^th on Georgia Public Broadcasting. 

The 2022 finalist teams are:

The Foambuster: The Foambuster is a unique handheld tool that allows construction contractors to drastically cut down on the mess, hassle, and money spent that comes with installing exterior insulation.

Edward Diller, Mechanical Engineering, Los Angeles, CA

Davis Waln, Mechanical Engineering, Atlanta, GA

Christophe Senghor, Mechanical Engineering, Peachtree City, GA

Katelyn Sand, Mechanical Engineering, Westlake Village, CA

Jaime Paris Meseguer, Mechanical Engineering, Spain

 

Magic Crop: An application that uses the power of Artificial Intelligence and the rule of thirds to format any number of inputted pictures into the perfect headshot within seconds and without ever sending any images to the cloud or to a third-party server.

Megan Dass, Computer Science, Woodbridge, VA

 

Reflex: Emergency Medical Drone Response System to deliver life-saving medical equipment.

Nevin Gilbert, Computer Science, Boulder, CO

Usman Jamal, Computer Science, Tucker, GA

 

Sola: Sola provides a data-driven supplemental insurance plan which covers immediate out-of-pocket expenses for US homeowners following losses from tornadoes.

Brayden Drury, Mechanical Engineering, Park City, Utah

Wesley Pergament, Mechanical Engineering, Old Westbury, NY

 

StrideLink: Accessible gait analysis wearable for remote monitoring of walking asymmetry.

Marzeah (Zea) Khorramabadi, Computer Engineering, Birmingham, AL

Cassandra (Cassie) McIltrot, Biomedical Engineering, Sykesville, MD

Neel Narvekar, Computer Engineering, Arcadia, CA

Tony Wineman, Electrical Engineering, Woodstock, GA

 

Tabnam: AI-powered shopping assistant that leverages the knowledge of user experience data.

SooHoon Choi, Computer Science, South Korea

Daksh Gupta, Computer Science, Noida, India

Robert (Davis) Liddell, Computer Science, Lutherville, MD

Ethan Perry, Computer Science, Wellesley, MA

 

To request tickets for the event visit: https://inventureprize.gatech.edu/form/inventure-prize-ticket-request-f

To learn more about InVenture Prize visit: https://inventureprize.gatech.edu/

 

Even a global pandemic cannot slow the acceleration of new technologies and evolving technologies that has become the disruptive norm of our lives over the past decade.

Big data, global connectedness and the digitization of almost everything are driving a whirlwind of change that touches every aspect of our lives.

Georgia Tech continues to be at the center of that of that maelstrom of progress, pushing the cutting edge, developing and influencing advances and being an insistent voice for ensuring those advances are shared as broadly as possible.

Five faculty members share what they see as major forces impacting the coming year and beyond.

 

Microchip shortage will drive manufacturing to US and other supply chain changes

One of the big technology and supply chain stories of 2021 was the global shortage of microchips that impacted huge parts of the business world. One of the more visible impacts of that shortage was in the automotive field.

According to industry experts, the microchip shortage cost the automotive business $210 billion in revenue in 2020 driving prices up for new and especially used vehicles throughout the year. Dr. Madhavan Swaminathan, Georgia Tech’s John Pippin Chair in Microsystems Packaging and Electromagnetics, says the industry’s focus on finding solutions will bring noticeable change in the coming year.

He says early word of a trend in moving chip manufacturing to the United States will become a big focus in the coming year as well as auto manufacturers and other industries re-examining just-in-time supply decisions as they build inventory. 

 

Advances in addressing bias in AI bolsters inclusion

In computer science circles, it is no longer any sort of surprise that there can be bias in certain applications of artificial intelligence and machine learning. Bias can stem from a range of factors from the data used to software design to the situation where AI is being used.

How to know what to show each user with different world views in search or newsfeeds is quite different than making sure that software used for healthcare works for everyone. For example, sometimes a data set, even a quite large one, may not be representative.

There are close to 100,000 cases of skin cancer in the U.S. a year, and it is difficult to detect, especially the darker someone's skin tone is.

Machine learning researchers are making huge advances in detecting skin cancer, but a big limit is that the data they are using comes from light-skinned populations.

Knowing this problem exists opens the door to using data and artificial intelligence to improve detection for all. Dr. Deven Desai, a law and ethics professor in Georgia Tech’s Scheller College of Business, says in the coming year, because this potential for bias is known, we will become much better at identifying bias from wherever it may come and addressing it to limit harm.

The focus in the coming year will be on making the searching and sifting tools of AI and machine learning more attuned to potentially skewed results. This focus will bring better, more inclusive results. 

Watch the video: A Good Challenge: The Future of AI

 

Digital twins drive safety, efficiency and savings in construction

Think of them as the ultimate in interactive blueprints that can actually communicate to owners about building performance. The idea of a digital twin is not new. Building an exact match, digital version of a construction project is commonplace in construction now and has been for years. Architectural drawings, CAD images, or BIM images would all be considered “twins” in a way.

The advances that are happening now with true digital twins and that will be taking off in the coming year are in what you can do with and learn from a much more robust digital twin.

"Digital twinning is about the building and all the components that are in the building. Where they are, what condition they're in, all kinds of qualities," says Russell Gentry director of the Digital Building Lab at Georgia Tech.

In the coming year, Gentry expects the idea of using a digital twin will grow as its uses expand - monitoring for maintenance needs, identifying potential problems like leaks or water damage, dialing in HVAC system efficiencies - just a few of the changes that are happening or soon will be. Digital twins will be used to improve building safety, efficiency and even retrofitting existing buildings with new and improved technologies.

The automation and improvements that can be achieved will be a powerful force in construction and building management.  

 

Technology led up-skilling drives job agility that will increase worker satisfaction and productivity

In the U.S. alone, November 2021 saw more than four and a half million people quit their jobs, the biggest spike on record and continuing a streak of transition and upheaval. As the pace of change continues to increase, we need to be able to rapidly reconfigure workforces to address new challenges.

Ashok Goel, professor of computer science and human-centered computing in the School of Interactive Computing, has been watching the rapid changes in the job market. He sees technology as a solution to reskilling employees. 

“It is critical that we leverage technology to develop better tools to sync up employers and educators so that job seekers have clear paths to reskilling,” Goel says.

Using AI to match workers to jobs, to improve job performance and satisfaction are just a few of the efforts in the coming year that will ultimately result in improved worker well-being and productivity as well.

 

Covid public health crisis leads to public policy evolution

The pandemic has defined very clearly a strain in the relationship between scientists and some segments of the general public.

Some public policy makers, as a reflection of that divide, have made decisions related to public health that do not always match generally accepted science. For academic leaders in public policy like Dr. Cassidy Sugimoto, the Marie Patton School Chair in the School of Public Policy at Georgia Tech, this is one of the biggest challenges our society and people making public policy will face in the coming years.

Bridging the divide made clear by Covid and building the relationships that will result in better policy will be an effort that will have impact for decades.

“In many ways we’re setting the stage for the other looming global crises that we’re being faced with like climate change, like issues around social justice.

All of those are going to take the same kind of navigation in communication between the public between science and between policy makers and not just within regions but globally,” said Sugimoto.

It’s a challenge that she and her colleagues have dedicated their careers to taking on.

Watch: Public Policy and the Pandemic

 

For more trends and in-depth predictions, read: The Year Ahead: Trends to Watch in 2022 

This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.

That includes making more of these chips here at home.