The world’s dependence on semiconductors came into sharp focus in 2021, when automotive manufacturing ground to a halt because of massive computer chip shortages – as Asian suppliers couldn’t keep up with demand for microelectronics –  miniaturized electronic circuits and components that drive everything from smartphones to new vehicle components to hypersonics weapons systems.

The culprit was global supply chain disruptions caused by the Covid-19 pandemic. The crisis has highlighted the pressing need for the U.S. to bolster its domestic semiconductor supply chains and industrial capacity, after three decades of decline as a semiconductor producer. The U.S. share of global semiconductor fabrication has dropped to 12% today, compared to 37% in 1990, according to the Semiconductor Industry Association (SIA). In addition, the semiconductor industry today only accounts for 250,000 direct U.S. jobs. 

As the country rebuilds its semiconductor infrastructure at home, Georgia Tech serves as a vital partner – to train the microelectronics workforce, drive future microelectronics advances, and provide unique fabrication and packaging facilities for industry, academic and government partners to develop and test new solutions.

“We’re one of the only universities that can support the whole microelectronics stack – from new materials and devices to packaging and systems,” said Madhavan Swaminathan, the John Pippin Chair in Microsystems Packaging in the School of Electrical and Computer Engineering  and director of the 3D Systems Packaging Research Center.

Continue reading this research feature, Microelectronics Momentum Drives the Nation's Semiconductor Research

 

 

When cell phones, electric vehicle chargers, or other electronic devices get too hot, performance degrades, and eventually overheating can cause them to shut down or fail. In order to prevent that from happening researchers are working to solve the problem of dissipating heat produced during performance. Heat that is generated in the device during operation has to flow out, ideally with little hinderance to reduce the temperature rise. Often this thermal energy must cross several dissimilar materials during the process and the interface between these materials can cause challenges by impeding heat flow.

A new study from researchers at the Georgia Institute of Technology, Notre Dame, University of California Los Angeles, University of California Irvine, Oak Ridge National Laboratory, and the Naval Research Laboratory observed interfacial phonon modes which only exist at the interface between silicon (Si) and germanium (Ge). This discovery, published in the journal Nature Communications, shows experimentally that decades-old conventional theories for interfacial heat transfer are not complete and the inclusion of these phonon modes are warranted.

“The discovery of interfacial phonon modes suggests that the conventional models of heat transfer at interfaces which only use bulk phonon properties are not accurate,” said the Zhe Cheng, a Ph.D. graduate from Georgia Tech’s George W. Woodruff School of Mechanical Engineering who is now a postdoc at University of Illinois at Urbana-Champaign (UIUC). “There is more space for research at the interfaces. Even though these modes are localized, they can contribute to thermal conductance across interfaces.”

The discovery opens a new pathway for consideration when engineering thermal conductance at interfaces for electronics cooling and other applications where phonons are majority heat carriers at material interfaces.

“These results will lead to great progress in real-world engineering applications for thermal management of power electronics,” said co-author Samuel Graham, a professor in the Woodruff School of Mechanical Engineering at Georgia Tech and new dean of engineering at University of Maryland. “Interfacial phonon modes should exist widely at solid interfaces. The understanding and manipulation of these interface modes will give us the opportunity to enhance thermal conductance across technologically-important interfaces, for example, GaN-SiC, GaN-diamond, β-Ga2O3-SiC, and β-Ga2O3-diamond interfaces.”

Presence of Interfacial Phonon Modes Confirmed in Lab

The researchers observed the interfacial phonon modes experimentally at a high-quality Si-Ge epitaxial interface by using Raman Spectroscopy and high-energy resolution electron energy-loss spectroscopy (EELS). To figure out the role of interfacial phonon modes in heat transfer at interfaces, they used a technique called time-domain thermoreflectance in labs at Georgia Tech and UIUC to determine the temperature-dependent thermal conductance across these interfaces.

They also observed a clean additional peak showing up in Raman Spectroscopy measurements when they measured the sample with Si-Ge interface, which was not observed when they measured a Si wafer and a Ge wafer with the same system. Both the observed interfacial modes and thermal boundary conductance were fully captured by molecular dynamics (MD) simulations and were confined to the interfacial region as predicted by theory.

“This research is the result of great team work with all the collaborators,” said Graham.  “Without this team and the unique tools that were available to us, this work would not have been possible.” 

Moving forward the researchers plan to continue to pursue the measurement and prediction of interfacial modes, increase the understanding of their contribution to heat transfer, and determine ways to manipulate these phonon modes to increase thermal transport. Breakthroughs in this area could lead to better performance in semiconductors used in satellites, 5G devices, and advanced radar systems, among other devices.

The epitaxial Si-Ge samples used in this research were grown at the U.S. Naval Research Lab. The TEM and EELS measurements were done at University of California, Irvine and Oak Ridge National Labs. The MD simulations were performed by the University of Notre Dame. The XRD study was done at UCLA. 

This work is financially supported by U.S. Office of Naval Research under a MURI project. The EELS study at UC Irvine is supported by U.S. Department of Energy. 

Citation: https://doi.org/10.1038/s41467-021-27250-3

About Georgia Institute of Technology

The Georgia Institute of Technology, or Georgia Tech, is a top 10 public research university developing leaders who advance technology and improve the human condition. The Institute offers business, computing, design, engineering, liberal arts, and sciences degrees. Its nearly 44,000 students representing 50 states and 149 countries, study at the main campus in Atlanta, at campuses in France and China, and through distance and online learning. As a leading technological university, Georgia Tech is an engine of economic development for Georgia, the Southeast, and the nation, conducting more than $1 billion in research annually for government, industry, and society.

Contact: 
Ben Wright 
Communications Manager
George W. Woodruff School of Mechanical Engineering
ben.wright@me.gatech.edu 
 

By Frida Carrera

 

On December 3, 2021, Startup Exchange presented the Fall 2021 Fellowship Pitch Competition sponsored by the Georgia Tech Student Innovation Program, Office of Undergraduate Education. The event took place at ATL Social Club in Tech Square, a major startup hub situated on Georgia Tech’s campus and perfect for those eager for innovation at GT. The event also welcomed partner companies and recruiters such as NCR and Stord. 

At this pitch-style event, six founder teams presented their innovative pitches and competed for first, second, and third place, each with a cash prize to aid in the advancement of their ideas. The first and second place winners of the competition were determined by three guest judges: Kathryn Petralia, co-founder of Kabbage and Drum; Thomas Suarez, co-founder of Teleport and Thiel Fellow; and Evan Jarecki, serial entrepreneur and BM at Startup Atlanta. The event commenced with a brief introduction by Startup Exchange executive board members, followed by presentations from the 6 teams including Fino, InSite, Jargon, and Tokenstack. After hearing each team’s pitch, the judges had time to deliberate and select the top two winners while the audience voted for the People’s Choice winner. Meanwhile, attendees were also able to hear from the partner companies and network while enjoying free perks such as food and beverages. 

“There are students everywhere across campus really starting on their start-ups and pursuing their dreams. Atlanta is a growing city and Georgia Tech is the perfect hub for that. These teams, we’re introducing them to entrepreneurship and giving those resources and intro-connections. By doing so, we’re inspiring them in a way. It’s just a great learning experience for them,” explained Startup Exchange’s Director of Fellowship Revanth Tiruveedhi.

Following the intermission, the judges presented the first-place award of $750 to Jargon, a browser extension that points out red flags in user contract agreements, as pitched by team members Kaleb Rasmussen and Devansh Khunteta. Second place of $500 was awarded to Eartheal by team members Colin Burnett, Philip Colt, Neal Austensen, and Brandon Sherrard. People's Choice of $250 was awarded to Tokenstack by team members Nitin Paul, Samrat Sahoo, Yatharth Bhargava, and Mohit Sahoo. The event then closed with remarks by Startup Exchange’s board members and photos with the participants.

To learn more about student innovation at Georgia Tech visit https://innovation.gatech.edu/  

 

 

With holiday shopping deadlines looming, consumers cannot escape the impact of the global microelectronic chip shortage. From daily news reports about manufacturers unable to complete orders due to the lack of chips, to “out of stock” messages across websites on popular electronics items, one of the impacts of COVID was to lay bare the massive importance of the microelectronic chip in daily modern life, and how a single-location centered manufacturing nexus can upend the consumer market on a massive scale. The combination of these real-world impacts on supply chains, as well as the need to localize semiconductor and chip manufacturing gave Congress the impetus to pass the “Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS)”. CHIPS seeks to increase investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.

The Georgia Institute of Technology was the first university to offer a comprehensive curriculum on microelectronics and microsystems design and packaging and, currently, numerous faculty at Georgia Tech are widely known for their work in semiconductor and microelectronics technologies. In December of 2021 Georgia Tech researchers will again showcase how their pushes the boundaries of microelectronics technologies at the IEEE International Electron Devices Meeting (IEDM).

The School of Electrical and Computer Engineering research teams of Assistant Professor Asif Khan, partnering with Dan Fielder Professor Muhannad Bakir, and Associate Professor Shimeng Yu, partnering with Professor Sung-Kyu Lim and Assistant Professor Shaolan Li, have dominated the 2021 IEDM presentation line-up with a total of 8 accepted papers. With topics ranging from ferroelectric materials for memory, new advances in ALD process, and in-memory computing and 3D reconfigurable architectures, the research presented by these teams is at the cutting-edge of advancing computing power and consumer electronics. In addition to the research presentations, Electrical and Computing Engineering Faculty & Director of the 3D Systems Packaging Research Center at GT will be presenting a short course session on devoted to “Heterogenous Integration Using Chiplets & Advanced Packaging”

Noting the timely nature of these research advancements, Arijit Raychowdhory; Professor and Steve W. Chaddick School Chair in Electrical and Computer Engineering noted, “IEDM is a premier conference in the area of semiconductor devices. Such a strong performance by GT ECE exemplifies the strength of our program, the ingenuity of our students and the innovation driven by our world-class faculty. Sincere congratulations to Professors Khan, Yu Bakir, Lim and Li for their pioneering research in semiconductor logic and memory technologies, that are critical for our nation and our industries.” 

Asif Khan is an assistant professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received his Ph.D. in electrical engineering and computer sciences from the University of California, Berkeley in 2015. His work led to the first experimental proof-of-concept demonstration of the negative capacitance effect in ferroelectric oxides. His group at Georgia Tech conceptualizes and fabricates electronic devices that leverage interesting physics and novel phenomena in emerging materials (such as ferroelectrics, antiferroelectrics and strongly correlated systems) to overcome the “fundamental” limits in computation and to address the most pressing challenges in electronics and the semiconductor industry.

Shimeng Yu is currently an associate professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received the B.S. degree in microelectronics from Peking University in 2009, and the M.S. degree and Ph.D. degree in electrical engineering from Stanford University in 2011 and 2013, respectively. From 2013 to 2018, he was an assistant professor at Arizona State University. Prof. Yu’s research interests are the semiconductor devices and integrated circuits for energy-efficient computing systems. His research expertise is on the emerging non-volatile memories for applications such as deep learning accelerator, in-memory computing, 3D integration, and hardware security.

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech.  Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), one from the IEEE Custom Integrated Circuits Conference (CICC), and two from the IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Muhannad S. Bakir received the B.E.E. degree from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Tech in 2000 and 2003, respectively. His research interests include, heterogeneous microsystem design and integration, including 2.5D and 3D ICs and packaging, electrical and photonic interconnects, and embedded cooling technologies.

Sung Kyu Lim received B.S. (1994), M.S. (1997), and Ph.D. (2000) degrees all from the Computer Science Department at UCLA. During 2000-2001, he was a post-doctoral scholar at UCLA, and a senior engineer at Aplus Design Technologies, Inc. Lim joined the School of Electrical and Computer Engineering at Georgia Institute of Technology an assistant professor. He is currently the director of the GTCAD (Georgia Tech Computer Aided Design) Laboratory and focuses on VLSI and 3D circuit architecture and packaging.

Shaolan Li received his B.Eng. degree with highest honor from the Hong Kong University of Science and Technology (HKUST) in 2012, and his Ph.D. from UT Austin in 2018, all in electrical engineering. Prior joining Georgia Tech as an assistant professor in 2019, he was a post-doctoral fellow in the Department of Electrical and Computer Engineering at UT Austin from 2018-2019. He also held intern positions in Broadcom Ltd. in Sunnyvale, California, and NXP in Tempe, Arizona during 2013-2014. His research interests are broadly in analog, mixed-signal, and RF integrated circuits. His expertise is in high-performance data converters, ultra-low-power low-cost sensor interface, and novel analog mixed-signal architectures for design automation.

The IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation. Georgia Tech research teams have a strong track of record in IEDM publications in the recent years, including 8, 4, 9 and 7 papers presented in IEDM 2018, 2019, 2020 and 2021, respectively.

 

- Christa M. Ernst

1. What is your field of expertise and at what point in your life did you first become interested in this area?

I work at the intersection of mechanics, metallurgy, machine learning, and manufacturing. I became interested in engineering as a small child – my grandfather was an engineer, and when I would spend time with my grandparents in the summer, I would go to work with him, and I was fascinated with drawing boards, alligator clips, circuits, and more. In high school, I started interning at the business he had built that primarily developed automation and test equipment for circuit breaker manufacturing (he had passed and my uncle then ran it). I started in the stock room, worked through the machine shop, assembly, and into quality control in my first years there. Then I became an engineering assistant as I went into my undergraduate studies. I had thought that I wanted to be electrical engineer (like my grandfather), but after 6 – 8 months of assisting EE, I realized that my true passion was in mechanical engineering, and I moved over to ME – so that foundation instilled in me that I had a passion for ME, manufacturing, and automation. The metallurgy came years later, when I won a graduate fellowship to work at NASA Glenn while earning my Master’s degree. I worked with metallurgists there who were developing new shape memory alloys, which fascinated me. I resisted materials science and metallurgy for many years, insisting that should be someone else’s job, and I should stick to manufacturing and ME. However, it became evident that you can’t engineer with shape memory alloys or develop their manufacturing unless you deeply understood their metallurgy – that resonated with me when I attended a conference in 2008 while working for a startup company that was commercializing some of the new shape memory alloys the group I’d worked with at NASA had developed. When I returned from that conference, I signed up for my PhD program the next week and dove deep into the intersection of metallurgy, manufacturing, and mechanics. The machine learning came years later, several years into my faculty career. We were working with several companies and the state Office of Economic Development in Colorado (I started my faculty career at Colorado School of Mines) to develop an R&D center and technology incubator to support the growing metals 3D printing industry. When I asked the industry people why they needed a center/consortium at Mines in this area – what were they not getting at other additive manufacturing centers at that time (this was 2014/2015), they said “no one is helping us with our data problems.” So, that became our mission – data informatics innovations in metals additive manufacturing. Here at GT, I’m thrilled by the opportunities, colleagues, and infrastructure available to bring it all together – our big vision for this IMat initiative is to develop R&D test beds and technology incubators for AI materials manufacturing.

2. Why is your theme area important to the development of Georgia Tech’s Materials research strategy?

Largely, our materials research laboratories (nation-wide and globally, not just at Georgia Tech) have been designed and built to support human operators. However, AI cannot independently function in the same way and in the same environments – or, at least, we will never realize its full potential if we make it play by our rules. Re-thinking and designing new materials laboratories that can operate autonomously and semi-autonomously is critical to be at the forefront of future innovations.

3. What are the broader global and social benefits of the research you and your team conduct?

Lowering barriers and times for the discovery and development of new materials and manufacturing – lower costs, faster times to deployment, increased sustainability, and finding better solutions. Also, with AI engines, the ability to distribute manufacturing to local/underserved parts of the globe and our nation – we saw this at the onset of COVID – when our corporate supply chain was unprepared to meet the demand, people were able to contribute respirators, masks, and more using the 3D printers in their garages, libraries, schools, universities, and hospitals and serve their community. However, people in their garages are rarely equipped to qualify/certify/ensure safety of critical parts and widgets on their own – the data infrastructure + AI enables qualification/certification to happen through statistics, and then rapid dissemination of the manufacturing “how to”. One could even imagine a future where the burden of qualification and certification could be shared across everyone participating in the supply chain – that will take a lot of policy and economic reform and rethinking as well, but as we gain confidence in our understanding of statistical models and data management infrastructure and software, it becomes more and more feasible.

4. What are your plans on engaging a wider GT faculty pool with IMat research?

I think the group of involved faculty now spans 7 or 8 schools and 3 colleges, at least – I’ve stopped counting, to be honest – the interest and support of colleagues here at GT is tremendous. On our larger proposals, there are anywhere from 20 – 30 faculty involved – I think this next one we may exceed 40. I welcome anyone who has ideas for how they can contribute or wants to learn more about the vision for AI materials + manufacturing test beds to email me anytime, and we’ll setup a time to meet and discuss. I also intend to hold some workshops and conferences – we received funding to start a consortium that will hold quarterly meetings for any interested business or faculty, and newsletters will also be sent, starting in 2022.

In the last few years, mechanically assistive exosuits, long depicted in works of popular science fiction and film, have finally started to see commercial deployment, according to Aaron Young, professor in the George W. Woodruff School of Mechanical Engineering at Georgia Tech. Most of these exosuits have a so-called passive design, assisting the wearer with unpowered elements like springs. 

Active exosuits that incorporate electronics and powered motors are yet to be broadly applied. They tend to be big and heavy, and rely on rigid exoskeletons to transfer weight from body to ground. Exoskeletons add a great deal of stiffness, as well, Young said. Putting on most active exosuits is a little like becoming one with a forklift, restricting a wearer to lifting weights in a vertical plane.

For all these reasons, Young’s Asymmetric Back eXosuit (ABX) described in the October 5 issue of IEEE Transactions on Robotics is highly non-standard. There’s no exoskeleton, no rigid structure, nothing that makes contact with the floor. If the wearer is just standing there, it does nothing except for adding 14 pounds to their legs. But if they raise their body from a leaning over position, it makes a somewhat frantic noise: that is the sound of the ABX helping them rotate their torso, helping them twist. 

Although most active exosuits support vertical lifts, rotating and twisting movements are also ubiquitous, especially in certain fields of manual labor like garbage collection and baggage handling. In many cases, these motions can be awkward and strenuous, leading to work-related injuries as well as back pain, according to Young. Back pain, in turn, is directly correlated with the strength of compressive forces and shear forces that are applied to the spine.

In designing their exosuit, the researchers sought a way to reduce these loads on the spinal joints. Putting it on looks a little like donning a futuristic backpack. Two motors are first strapped onto the back of each upper thigh. These motors are then connected to the back of the opposite shoulders, each with their own cable, making for two cables that diagonally overlap. The exosuit provides assistance by applying tension to the cables when it detects a wearer rise from a bending posture.

“It's definitely a different sensation than a sort of standard exoskeleton. It's not your standard design,” said Young. 

Because the diagonal cables have a component of motion that is horizontal, they exert a pull on the torso that can aid in twisting it from side to side. In tests, the researchers showed that when a wearer of the ABX swung a weight from the ground to one side, the exosuit reduced their back muscle activations by an average of 16%, as measured by electromyography (EMG) sensors. The exosuit also provided a 37% reduction in back muscle exertion when a wearer lifted weights symmetrically, straight off the ground – an assistance level comparable to more rigid designs. 

“People definitely felt like the technology is assisting them, which is great. And we did see the concurrent EMG reduction,” said Young. “I think it’s a great first step.”

In a sense, wearing the exosuit is almost like strapping two additional muscles onto the body – unconventional muscles, which run directly from back to leg. Interestingly, it is the positioning of these muscles rather than their brute strength that makes them functional, said Young.

The motors pull the cables with much less power than the muscles in the body. However, the cables are positioned much further away from the joints. Through this positioning, the cables obtain greater leverage and mechanical advantage, allowing the wearer to reduce their overall muscular output and hence the load that they place on their spine. (Spinal loading was not directly measured in the study.)

Aside from its overall performance, it is the flexible, asymmetric nature of the suit that really makes it unique, Young said. There are currently no other active exosuits that provide assistance for twisting and rotating through a comparable range of motion. While other exosuits also use cables, none have arranged them along diagonal lines.

Young is currently seeking collaborations with industry partners to further develop the exosuit. In future work, he sees its control system as a point to improve. Currently, when a person raises their torso from a lowered position, the cables simply pull with constant tension. But it should be possible to make the system detect different actions of the wearer and adjust its pull in response.

References

J. M. Li, D. D. Molinaro, A. S. King, A. Mazumdar and A. J. Young, "Design and Validation of a Cable-Driven Asymmetric Back Exosuit," in IEEE Transactions on Robotics, doi: 10.1109/TRO.2021.3112280.

About Georgia Tech

The Georgia Institute of Technology, or Georgia Tech, is a top 10 public research university developing leaders who advance technology and improve the human condition. The Institute offers business, computing, design, engineering, liberal arts, and sciences degrees. Its nearly 40,000 students representing 50 states and 149 countries, study at the main campus in Atlanta, at campuses in France and China, and through distance and online learning. As a leading technological university, Georgia Tech is an engine of economic development for Georgia, the Southeast, and the nation, conducting more than $1 billion in research annually for government, industry, and society.

By Jessica Barber

On April 21, 2021, biomedical engineering student Michael Pullen will serve as Georgia Tech’s representative in the fifth annual ACC InVenture Prize. Here he will compete with teams from twelve other universities for the chance to take home $30,000 in prizes.

Pullen’s invention first took root when he experienced the struggle of getting turf burn while playing football. While most players seek protection through regular compression sleeves, this often leads to decreased grip, more fumbles, and difficulty in maneuvering plays.

While working in sports medicine with the Atlanta Falcons, Pullen found a way to directly avoid this problem. LZRD Sleeve is a compressive sleeve that integrates gripping and moisture-wicking technology to deliver protection and control without sacrificing mobility nor comfort. 

Since then, LZRD Sleeve has secured its place in non-athletic arenas. A year ago, the world of sports halted due to COVID-19 shutdowns. It was then that Pullen sought other applications for his innovative sleeve — LZRD Sleeve has expanded its market to delivery drivers, gardeners, and maintenance workers seeking better performance and protection from harm. 

LZRD Sleeve is now being used by the largest U.S. courier service, and it has also been featured in Neil DeGrasse Tyson’s podcast StarTalk. On the same hand, Pullen has been in contact with a whopping five Fortune 500 companies. He ultimately hopes that InVenture Prize will show that with hard work, nothing is impossible.

 “Never in a million years would I have thought I would be representing Georgia Tech in the ACC InVenture Prize. Getting out of your comfort zone and trying new things is important, and by winning, I hope to set an example so that others might do the same,” Pullen stated.

Overall, winning the ACC InVenture Prize would allow LZRD Sleeve to expand even further through capital investments, uptakes in production, and coverage of associated legal fees.

The Georgia Tech community is encouraged to show Pullen its support through voting for the People’s Choice Award of $5,000. Voting is open from 8 a.m. on Monday, April 5 until midnight on Tuesday, April 6.

To vote, please text GATech to win the ACC InVenture Prize People’s Choice Award to 415-965-7445.

Winners will be announced on Wednesday, April 21 at 7 p.m. on PBS stations throughout the ACC region. 

More information about LZRD Sleeve can be found at lzrdtech.com.

The President's Undergraduate Research Award pays selected students $1500 to conduct undergraduate research. Applications for summer 2021 funding are due on February 26, 2021. 

Apply online at urop.gatech.edu

California, September 14, 2020: TiE Global hosted the 2nd edition of the TiE University Pitch Competition over the weekend. Cash prizes of close to $14,000 and almost $35,000 worth of in-kind prizes were given out to the 13 participants. TiE Atlanta’s Aerodyme Technologies from Georgia Institute of Technology came in first, winning $5000. TiE Silicon Valley’s team Ambii from San Jose State University bagged the second prize, winning $3000; while TiE Toronto’s LSK Technologies, a MedTech startup from the University of Toronto emerged as the third winner, winning $2000.

The winning team, Aerodyme Technologies has created a novel device that saves fuel costs for tractor-trailers by minimizing aerodynamic drag. Ambii, which came in second, provides an in-store music streaming platform for retail outlets, cafes and restaurants without the hassles of licensing. Third prize winner, LSK Technologies, created a diagnostic device for testing infectious diseases such as Covid19 at the point of need. 

Congratulating the winning team, Mahavir Pratap Sharma, Chairman of the TiE Global Board of Trustees said, "We are proud of these young talented entrepreneurs. Their growth story from pitches at their local TiE Chapters till the Global Finals has seen a massive expansion and iteration of thought and structure. This is a complete team effort put forward by the program co-chairs and charter member mentors who helped them grow their idea, giving them thorough guidance and mentoring the students over the last few months to compete on a global stage.”

Aerodyme Technologies participated in Georgia Tech’s CREATE-X Startup Launch program during summer 2019. During the startup accelerator program, the Aerodyme team was able to conduct customer discovery and receive mentorship and funding to take their product to market. The team also won 2nd place in the 12th annual InVenture Prize competition in March 2020. As part of the competition, Aerodyme received $10,000 in cash and patent filing assistance funded by the Georgia Tech Research Corporations. 

The second edition of the TiE University jointly organized by TiE Atlanta & TiE Hyderabad had 13 teams representing TiE chapters from India, Israel, UAE, Israel, USA, and Canada. These teams were previously the chapter winners and were then mentored to participate in the Global finals. After the Semi-final round on Saturday, seven teams were selected for the finals. Teams had a 10-minute pitch to an eminent Jury panel and a 5-minute live Q&A. 

Speaking at the Presentation Ceremony the TiE University program co-chairs Dr. Paul Lopez, SubbaRaju Pericherlaand Viiveck Verma, said they are looking to expand the program participation to 40 chapters and 400+ universities worldwide by 2022.

The worldwide jury panel for the finals, consisting of VCs and investors, included Bodhi Capital’s  Dharti Desai, Silicon Valley Bank’s Priya Rajan, Elevate Capital’s Kumar Sripadam, and Inflexor Ventures’ Venkat Vallabhaneni.  Semi-finals judges from across the globe included Craig Abbott, Rakesh Bhatia, Radhika Iyengar, Rama Devi Kanneganti, Doc Parghi, and Sonia Weymuller.

Apart from the top three winners, prizes were announced in various other categories. Silicon Valley’s Ambii and New Jersey’s Volant from New Jersey Institute of Technology jointly received a $1,500 Best Elevator Pitch award. Similarly, Teams Clean Electric from IIT/BHU, Varanasi representing TiE Mumbai, and Aruga Technologies from Carnegie Mellon University representing TiE Pittsburgh jointly received $1,500 Best Technology prize. Frinks, from IIT Hyderabad, representing TiE Hyderabad took the $500 People's Choice Award. Apart from this, all participating teams walked away with technology and service prizes worth $2500 per team.

The competition also hosted a keynote address by serial entrepreneur Thejo Kote. Thejo sold his connectivity startup, Automatic for $115 million to SiriusXm. He inspired the university startup teams and online audience alike by saying, “The biggest lesson I’ve learned along the way is to make sure you enjoy the journey (of building a startup) and it’s something that you learn from and grow from. Else it will be a lot more challenging.”

 

About TiE University:

TiE University program focuses on enhancing the learning objectives of university students globally through the creation and presentation of business pitches for startups and new small business ventures so that they aspire to become entrepreneurs. TiE University is looking to expand its reach to 40 chapters and 400+ universities worldwide. If you’re interested, reach out to the below-mentioned media contact. For more information, visit - https://tie.org/tie-university/

 

About TiE Global:

TiE Global, is a non-profit organization dedicated to fostering entrepreneurship around the World. TiE strives to inspire entrepreneurs through mentoring, networking, education, incubating and funding programs and activities. With nearly 2000+ events held each year, TiE brings together the entrepreneurial community to learn from local leaders, as well as each other. Few of the annual flagship events conducted by TiE are TYE, TiE Women, TiE University, TiECons and TGS. For more information, please visit our website at https://tie.org/

 

Media Contact:

Aparna Mishra Aparna@tie.org

By Jessica Barber

           On Wednesday, September 16, the Office of Undergraduate Education (OUE) hosted the kick-off session for the 13th Annual InVenture Prize. With over $35,000 in prizes, the competition is the holy grail of college entrepreneurship. Although the InVenture Prize officially starts in January 2021, students have already begun their preparations and idea declarations.

Unlike previous years, the kick-off was hosted online through Gatherly, a virtual event platform recently built by none other than Georgia Tech students. Despite this, attendees did not miss a beat. The kick-off marked a return to normalcy for the Georgia Tech innovation community from learning key information about the competition to directly speaking with past winners.

           After a welcome from interim Assistant Director of Student Innovation, Recha Reid, students were given an overview of some upcoming InVenture Prize events, including the ongoing Pitch Your Idea and IdeaBuzz sessions. Students were given an overview of OUE’s customer discovery, financial forecasting, marketing, and patent/copyright workshops. From there, the floor was turned over to Dr. Chris Reaves, executive director of the office for Academic Enrichment Programs.

           “At its core, the InVenture Prize is an invention startup competition, but we work together — even the teams work with each other — to help one another. We achieve more, grow more, and develop our companies better when we’re helping each other, and that’s a big part of what we’re doing,” Reaves explained.

           Later, students were given the opportunity to speak with representatives from Queues and Aerodyme, the respective first- and second-place winners of the 2020 InVenture Prize. Students learned firsthand what it takes to succeed on the InVenture Prize stage; the teams later offered advice on the invention process, their lessons learned, and the visibility benefits of participating in the competition.

           “If you’re on the edge right now about doing InVenture Prize, definitely do it. We actually had that same thought before we did it, and we’re just so glad that we did. It’s a lot of work, and you’re going to step outside of your comfort zone, but it’s so worth it”, said Joy Bullington of team Aerodyme Technologies. 

           Queues team member Sam Porta similarly had some words of encouragement for those looking into the 2021 InVenture Prize. 

           “The difference between an entrepreneur and someone who’s just engineering something is persistence, and the InVenture Prize is a great opportunity to test this. If you think you’ve come up with something great that has a lot of value, then, by all means, do it,” Porta emphasized.

           Towards the end of the session, students were invited to visit virtual “booths” dedicated to areas of health, retail, fintech, transportation, education tools, gaming, and networking.

           “InVenture is honestly one of the reasons I chose to come to Tech, and I’m just so excited to come into with something that I’m really confident about,” an attendee said.

           “The most interesting thing about tonight was hearing from the past winners and having them talk about their experiences. Definitely super excited to apply, and hopefully we do really well,” another stated.

           Registration for the 2021 InVenture Prize will remain open until January. Student innovators are invited to check out OUE’s information and development sessions to be held throughout the Fall semester. All dates and related topics can be found at innovation.gatech.edu and inventureprize.gatech.edu.

 

FIND OUT MORE ABOUT THE 2021 INVENTURE PRIZE BY CLICKING HERE

 

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