5G+ (5G/Beyond 5G) is the fastest-growing segment and the only significant opportunity for investment growth in the wireless network infrastructure market, according to the latest forecast by Gartner, Inc. But currently 5G+ technologies rely on large antenna arrays that are typically bulky and come only in very limited sizes, making them difficult to transport and expensive to customize.

Researchers from Georgia Tech’s College of Engineering have developed a novel and flexible solution to address the problem. Their additively manufactured tile-based approach can construct on-demand, massively scalable arrays of 5G+ (5G/Beyond 5G)‐enabled smart skins with the potential to enable intelligence on nearly any surface or object. The study, recently published in Scientific Reports, describes the approach, which is not only much easier to scale and customize than current practices, but features no performance degradation whenever flexed or scaled to a very large number of tiles.

“Typically, there are a lot of smaller wireless network systems working together, but they are not scalable. With the current techniques, you can’t increase, decrease, or direct bandwidth, especially for very large areas,” said Manos Tentzeris, Ken Byers Professor in Flexible Electronics in the School of Electrical and Computer Engineering. “Being able to utilize and scale this novel tile-based approach makes this possible.”

Tentzeris says his team’s modular application equipped with 5G+ capability has the potential for immediate, large-scale impact as the telecommunications industry continues to rapidly transition to standards for faster, higher capacity, and lower latency communications.

BUILDING THE TILES

In Georgia Tech’s new approach, flexible and additively manufactured tiles are assembled onto a single, flexible underlying layer. This allows tile arrays to be attached to a multitude of surfaces. The architecture also allows for very large 5G+ phased/electronically steerable antenna array networks to be installed on-the-fly. According to Tentzeris, attaching a tile array to an unmanned aerial vehicle (UAV) is even a possibility to surge broadband capacity in low coverage areas.

In the study, the team fabricated a proof-of-concept, flexible 5×5-centimeter tile array and wrapped it around a 3.5-centimeter radius curvature. Each tile includes an antenna subarray and an integrated, beamforming integrated circuit on an underlying tiling layer to create a smart skin that can seamlessly interconnect the tiles into very large antenna arrays and massive multiple-input multiple-outputs (MIMOs) — the practice of housing two or more antennas within a single wireless device. Tile-based array architectures on rigid surfaces with single antenna elements have been researched before, but do not include the modularity, additive manufacturability, or flexible implementation of the Georgia Tech design.

The proposed modular tile approach means tiles of identical sizes can be manufactured in large quantities and are easily replaceable, reducing the cost of customization and repairs. Essentially, this approach combines removable elements, modularity, massive scalability, low cost, and flexibility into one system.

5G+ IS JUST THE BEGINNING

While the tiling architecture has demonstrated the ability to greatly enhance 5G+ technologies, its combination of flexible and conformal capabilities has the potential to be applied in numerous different environments, the Georgia Tech team says.

“The shape and features of each tile scale can be singular and can accommodate different frequency bands and power levels,” said Tentzeris. “One could have communications capabilities, another sensing capabilities, and another could be an energy harvester tile for solar, thermal, or ambient RF energy. The application of the tile framework is not limited to communications.”

Internet of Things, virtual reality, as well as smart manufacturing/Industry 4.0 — a technology-driven approach that utilizes internet-connected “intelligent” machinery to monitor and fully automate the production process — are additional areas of application the team is excited to explore.

“The tile-architecture’s mass scalability makes its applications particularly diverse and virtually ubiquitous. From structures the size of dams and buildings, to machinery or cars, down to individual health-monitoring wearables,” said Tentzeris. “We’re moving in a direction where everything will be covered in some type of a wireless conformal smart skin encompassing electronically steerable antenna arrays of widely diverse sizes that will allow for effective monitoring.”

The team now looks forward to testing the approach outside the lab on large, real-world structures. They are currently working on the fabrication of much larger, fully inkjet-printed tile arrays (256+ elements) that will be presented at the upcoming International Microwave Symposium (IEEE IMS 2022) – the flagship IEEE conference in RF and microwave engineering. The IMS presentation will introduce a new tile-based large-area architecture version that will allow assembly of customizable tile arrays in a rapid and low-cost fashion for numerous conformal platforms and 5G+ enabled applications.

****

The authors declare no competing interests.

This work was supported in part by the National Science Foundation.

CITATIONS: He, X., Cui, Y. & Tentzeris, M.M. Tile-based massively scalable MIMO and phased arrays for 5G/B5G-enabled smart skins and reconfigurable intelligent surfaces. Sci Rep 12, 2741 (2022). https://doi.org/10.1038/s41598-022-06096-9

K.Hu, G.S.V.Angulo, Y.Cui and M.M.Tentzeris, “Flexible and Scalable Additively Manufactured Tile-Based Phased Arrays for Satellite Communications and 5G mmWave Applications,” accepted for presentation at IEEE International Microwave Symposium (IMS) 2022, Denver, CO, June 2022.

By Frida Carrera

 

During the summer of 2021, computer science student Neil Sanghavi and computer science recent grad Ahan Shah, both from Fairfax, VA, reconnected to catch up with one another and discuss the projects they were working on. In doing so they discovered a mutual resolve to create something using innovative technology and solve a problem relating to intellectual property, specifically patents. Both Neil and Ahan had just started to get into crypto trading and realized that NFT technology had more to offer than its collectible aspect. Here the idea of PatentX was created: to use NFT technology to provide utility in an antiquated space that lacked efficiency.

“It is estimated that we have $1 trillion in unused IP in the United States currently. Additionally, it is reported that there is $25.6 billion worth of patent monetization available today. This is why we created PatentX, a blockchain-backed marketplace to facilitate intellectual property transactions. We built this to make sure the little man innovators and entrepreneurs have an outlet to monetize and connect their patents with the world. Not only that, we are creating tools for large businesses, law firms, venture capitals to manage all of their IP on the blockchain that can handle transactions in seconds.”

Neil and Ahan describe their product launch process as a great learning experience and are firm believers that there can never be too much help. They are currently supported by DXPartners and have received help from various mentors and blockchain professionals. They have been able to traverse obstacles and learn about the marketing, finance, and business aspects behind building a startup despite coming from a technical background. 

Their vision for PatentX is to disrupt the traditional way intellectual property is being transacted and to become the World’s Next Web3 Patent Office. PatentX will be releasing an NFT collection of the most historic patent innovations this early March and encourage interested individuals to stay tuned for their launch. 

 

To learn more about PatentX visit their social media: 

Twitter: @PatentXNFT

Instagram: @PatentX.io

 

To learn more about student innovation at Georgia Tech visit: https://innovation.cae.gatech.edu/

 

 

By Frida Carrera

 

On April 2, 2022, Team carSEAL will represent Georgia Tech in the 6^th annual ACC InVenture Prize Competition hosted this year by Florida State University. Team members Shovan Bhatia, Joshua Cruz, Nicholas Lima, Derek Prusener, and Giancarlo Riccobono will compete against other teams in the ACC Conference for a chance to win up to $30,000 in prizes. 

carSEAL began with five biomedical engineering students collaborating on a capstone project. After being accepted into the highly sought-after Mayo Clinic Capstone Project, they received mentorship from Dr. Rabih Tawk, a world-renowned neurosurgeon. With his guidance, they learned that surgeons currently lack the tools to close the carotid artery after endovascular procedures. Through a pragmatic approach, the team developed 100+ conceptual designs and iterations. After numerous discussions with attending surgeons across the nation and preliminary testing, they developed carSEAL – a vascular closure device for the carotid artery. 

So far, the team has found the InVenture Prize process to be exhilarating.

“Through each round of this process, we have seen incredible teams working on impactful projects and it is exciting to be surrounded by such brilliant minds from numerous backgrounds. It has been especially rewarding working with so many supportive advisors from Georgia Tech, who have been through the startup process and have freely offered their expertise. Along each step of this process, we have learned something new to refine our pitch and ensure we are presenting our most competitive self at the ACC.”

Currently, aside from preparing for the ACC InVenture Prize, the carSEAL team is performing benchtop lab testing to evaluate its efficacy in animal models. Soon after, the team will be moving to pre-clinical studies on their path to obtaining FDA clearance before carSEAL is commercialized. Winning the ACC InVenture Prize would help them gain more traction and gather sufficient funds to help them with this process.

“I am extremely proud of our team’s achievements in the short 6 months that we have worked together. carSEAL has gained a lot of traction already and we are excited to see how far we can take this, hopefully bringing carSEAL to clinical practice within a few years,” Bhatia stated.

The Georgia Tech community can support carSEAL in the competition by voting for them for the People’s Choice Awards by visiting: https://accinventureprize.com/peoples-choice-voting. Online voting begins March 28.

To learn more about the ACC InVenture Prize visit https://accinventureprize.com.

By Frida Carrera

After almost a year of preparation, practice, and refinement, Georgia Tech’s annual InVenture Prize is down to six finalists competing in the final round on March 16^th. In this televised round, the final teams will pitch their inventions to a panel of judges and compete for the top prize of $20,000, assistance in patent-filing, and a spot in CREATE-X’s Startup Launch program.

In its 14^th year, the InVenture Prize competition features different innovations created by Georgia Tech students from all disciplines and backgrounds. For months prior to the final round, the finalists received coaching and assistance from mentors and coaches on building their prototypes, developing business models, and rehearsing their pitches to investors. The final six teams were chosen from previous preliminary and semifinal rounds that included a broad range of competitors. 

The finals of the InVenture Prize will air live from Georgia Tech’s Ferst Center for the Arts at 7:30 p.m. on March 16^th on Georgia Public Broadcasting. 

The 2022 finalist teams are:

The Foambuster: The Foambuster is a unique handheld tool that allows construction contractors to drastically cut down on the mess, hassle, and money spent that comes with installing exterior insulation.

Edward Diller, Mechanical Engineering, Los Angeles, CA

Davis Waln, Mechanical Engineering, Atlanta, GA

Christophe Senghor, Mechanical Engineering, Peachtree City, GA

Katelyn Sand, Mechanical Engineering, Westlake Village, CA

Jaime Paris Meseguer, Mechanical Engineering, Spain

 

Magic Crop: An application that uses the power of Artificial Intelligence and the rule of thirds to format any number of inputted pictures into the perfect headshot within seconds and without ever sending any images to the cloud or to a third-party server.

Megan Dass, Computer Science, Woodbridge, VA

 

Reflex: Emergency Medical Drone Response System to deliver life-saving medical equipment.

Nevin Gilbert, Computer Science, Boulder, CO

Usman Jamal, Computer Science, Tucker, GA

 

Sola: Sola provides a data-driven supplemental insurance plan which covers immediate out-of-pocket expenses for US homeowners following losses from tornadoes.

Brayden Drury, Mechanical Engineering, Park City, Utah

Wesley Pergament, Mechanical Engineering, Old Westbury, NY

 

StrideLink: Accessible gait analysis wearable for remote monitoring of walking asymmetry.

Marzeah (Zea) Khorramabadi, Computer Engineering, Birmingham, AL

Cassandra (Cassie) McIltrot, Biomedical Engineering, Sykesville, MD

Neel Narvekar, Computer Engineering, Arcadia, CA

Tony Wineman, Electrical Engineering, Woodstock, GA

 

Tabnam: AI-powered shopping assistant that leverages the knowledge of user experience data.

SooHoon Choi, Computer Science, South Korea

Daksh Gupta, Computer Science, Noida, India

Robert (Davis) Liddell, Computer Science, Lutherville, MD

Ethan Perry, Computer Science, Wellesley, MA

 

To request tickets for the event visit: https://inventureprize.gatech.edu/form/inventure-prize-ticket-request-f

To learn more about InVenture Prize visit: https://inventureprize.gatech.edu/

 

Even a global pandemic cannot slow the acceleration of new technologies and evolving technologies that has become the disruptive norm of our lives over the past decade.

Big data, global connectedness and the digitization of almost everything are driving a whirlwind of change that touches every aspect of our lives.

Georgia Tech continues to be at the center of that of that maelstrom of progress, pushing the cutting edge, developing and influencing advances and being an insistent voice for ensuring those advances are shared as broadly as possible.

Five faculty members share what they see as major forces impacting the coming year and beyond.

 

Microchip shortage will drive manufacturing to US and other supply chain changes

One of the big technology and supply chain stories of 2021 was the global shortage of microchips that impacted huge parts of the business world. One of the more visible impacts of that shortage was in the automotive field.

According to industry experts, the microchip shortage cost the automotive business $210 billion in revenue in 2020 driving prices up for new and especially used vehicles throughout the year. Dr. Madhavan Swaminathan, Georgia Tech’s John Pippin Chair in Microsystems Packaging and Electromagnetics, says the industry’s focus on finding solutions will bring noticeable change in the coming year.

He says early word of a trend in moving chip manufacturing to the United States will become a big focus in the coming year as well as auto manufacturers and other industries re-examining just-in-time supply decisions as they build inventory. 

 

Advances in addressing bias in AI bolsters inclusion

In computer science circles, it is no longer any sort of surprise that there can be bias in certain applications of artificial intelligence and machine learning. Bias can stem from a range of factors from the data used to software design to the situation where AI is being used.

How to know what to show each user with different world views in search or newsfeeds is quite different than making sure that software used for healthcare works for everyone. For example, sometimes a data set, even a quite large one, may not be representative.

There are close to 100,000 cases of skin cancer in the U.S. a year, and it is difficult to detect, especially the darker someone's skin tone is.

Machine learning researchers are making huge advances in detecting skin cancer, but a big limit is that the data they are using comes from light-skinned populations.

Knowing this problem exists opens the door to using data and artificial intelligence to improve detection for all. Dr. Deven Desai, a law and ethics professor in Georgia Tech’s Scheller College of Business, says in the coming year, because this potential for bias is known, we will become much better at identifying bias from wherever it may come and addressing it to limit harm.

The focus in the coming year will be on making the searching and sifting tools of AI and machine learning more attuned to potentially skewed results. This focus will bring better, more inclusive results. 

Watch the video: A Good Challenge: The Future of AI

 

Digital twins drive safety, efficiency and savings in construction

Think of them as the ultimate in interactive blueprints that can actually communicate to owners about building performance. The idea of a digital twin is not new. Building an exact match, digital version of a construction project is commonplace in construction now and has been for years. Architectural drawings, CAD images, or BIM images would all be considered “twins” in a way.

The advances that are happening now with true digital twins and that will be taking off in the coming year are in what you can do with and learn from a much more robust digital twin.

"Digital twinning is about the building and all the components that are in the building. Where they are, what condition they're in, all kinds of qualities," says Russell Gentry director of the Digital Building Lab at Georgia Tech.

In the coming year, Gentry expects the idea of using a digital twin will grow as its uses expand - monitoring for maintenance needs, identifying potential problems like leaks or water damage, dialing in HVAC system efficiencies - just a few of the changes that are happening or soon will be. Digital twins will be used to improve building safety, efficiency and even retrofitting existing buildings with new and improved technologies.

The automation and improvements that can be achieved will be a powerful force in construction and building management.  

 

Technology led up-skilling drives job agility that will increase worker satisfaction and productivity

In the U.S. alone, November 2021 saw more than four and a half million people quit their jobs, the biggest spike on record and continuing a streak of transition and upheaval. As the pace of change continues to increase, we need to be able to rapidly reconfigure workforces to address new challenges.

Ashok Goel, professor of computer science and human-centered computing in the School of Interactive Computing, has been watching the rapid changes in the job market. He sees technology as a solution to reskilling employees. 

“It is critical that we leverage technology to develop better tools to sync up employers and educators so that job seekers have clear paths to reskilling,” Goel says.

Using AI to match workers to jobs, to improve job performance and satisfaction are just a few of the efforts in the coming year that will ultimately result in improved worker well-being and productivity as well.

 

Covid public health crisis leads to public policy evolution

The pandemic has defined very clearly a strain in the relationship between scientists and some segments of the general public.

Some public policy makers, as a reflection of that divide, have made decisions related to public health that do not always match generally accepted science. For academic leaders in public policy like Dr. Cassidy Sugimoto, the Marie Patton School Chair in the School of Public Policy at Georgia Tech, this is one of the biggest challenges our society and people making public policy will face in the coming years.

Bridging the divide made clear by Covid and building the relationships that will result in better policy will be an effort that will have impact for decades.

“In many ways we’re setting the stage for the other looming global crises that we’re being faced with like climate change, like issues around social justice.

All of those are going to take the same kind of navigation in communication between the public between science and between policy makers and not just within regions but globally,” said Sugimoto.

It’s a challenge that she and her colleagues have dedicated their careers to taking on.

Watch: Public Policy and the Pandemic

 

For more trends and in-depth predictions, read: The Year Ahead: Trends to Watch in 2022 

This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.

That includes making more of these chips here at home.  

The world’s dependence on semiconductors came into sharp focus in 2021, when automotive manufacturing ground to a halt because of massive computer chip shortages – as Asian suppliers couldn’t keep up with demand for microelectronics –  miniaturized electronic circuits and components that drive everything from smartphones to new vehicle components to hypersonics weapons systems.

The culprit was global supply chain disruptions caused by the Covid-19 pandemic. The crisis has highlighted the pressing need for the U.S. to bolster its domestic semiconductor supply chains and industrial capacity, after three decades of decline as a semiconductor producer. The U.S. share of global semiconductor fabrication has dropped to 12% today, compared to 37% in 1990, according to the Semiconductor Industry Association (SIA). In addition, the semiconductor industry today only accounts for 250,000 direct U.S. jobs. 

As the country rebuilds its semiconductor infrastructure at home, Georgia Tech serves as a vital partner – to train the microelectronics workforce, drive future microelectronics advances, and provide unique fabrication and packaging facilities for industry, academic and government partners to develop and test new solutions.

“We’re one of the only universities that can support the whole microelectronics stack – from new materials and devices to packaging and systems,” said Madhavan Swaminathan, the John Pippin Chair in Microsystems Packaging in the School of Electrical and Computer Engineering  and director of the 3D Systems Packaging Research Center.

Continue reading this research feature, Microelectronics Momentum Drives the Nation's Semiconductor Research

 

 

When cell phones, electric vehicle chargers, or other electronic devices get too hot, performance degrades, and eventually overheating can cause them to shut down or fail. In order to prevent that from happening researchers are working to solve the problem of dissipating heat produced during performance. Heat that is generated in the device during operation has to flow out, ideally with little hinderance to reduce the temperature rise. Often this thermal energy must cross several dissimilar materials during the process and the interface between these materials can cause challenges by impeding heat flow.

A new study from researchers at the Georgia Institute of Technology, Notre Dame, University of California Los Angeles, University of California Irvine, Oak Ridge National Laboratory, and the Naval Research Laboratory observed interfacial phonon modes which only exist at the interface between silicon (Si) and germanium (Ge). This discovery, published in the journal Nature Communications, shows experimentally that decades-old conventional theories for interfacial heat transfer are not complete and the inclusion of these phonon modes are warranted.

“The discovery of interfacial phonon modes suggests that the conventional models of heat transfer at interfaces which only use bulk phonon properties are not accurate,” said the Zhe Cheng, a Ph.D. graduate from Georgia Tech’s George W. Woodruff School of Mechanical Engineering who is now a postdoc at University of Illinois at Urbana-Champaign (UIUC). “There is more space for research at the interfaces. Even though these modes are localized, they can contribute to thermal conductance across interfaces.”

The discovery opens a new pathway for consideration when engineering thermal conductance at interfaces for electronics cooling and other applications where phonons are majority heat carriers at material interfaces.

“These results will lead to great progress in real-world engineering applications for thermal management of power electronics,” said co-author Samuel Graham, a professor in the Woodruff School of Mechanical Engineering at Georgia Tech and new dean of engineering at University of Maryland. “Interfacial phonon modes should exist widely at solid interfaces. The understanding and manipulation of these interface modes will give us the opportunity to enhance thermal conductance across technologically-important interfaces, for example, GaN-SiC, GaN-diamond, β-Ga2O3-SiC, and β-Ga2O3-diamond interfaces.”

Presence of Interfacial Phonon Modes Confirmed in Lab

The researchers observed the interfacial phonon modes experimentally at a high-quality Si-Ge epitaxial interface by using Raman Spectroscopy and high-energy resolution electron energy-loss spectroscopy (EELS). To figure out the role of interfacial phonon modes in heat transfer at interfaces, they used a technique called time-domain thermoreflectance in labs at Georgia Tech and UIUC to determine the temperature-dependent thermal conductance across these interfaces.

They also observed a clean additional peak showing up in Raman Spectroscopy measurements when they measured the sample with Si-Ge interface, which was not observed when they measured a Si wafer and a Ge wafer with the same system. Both the observed interfacial modes and thermal boundary conductance were fully captured by molecular dynamics (MD) simulations and were confined to the interfacial region as predicted by theory.

“This research is the result of great team work with all the collaborators,” said Graham.  “Without this team and the unique tools that were available to us, this work would not have been possible.” 

Moving forward the researchers plan to continue to pursue the measurement and prediction of interfacial modes, increase the understanding of their contribution to heat transfer, and determine ways to manipulate these phonon modes to increase thermal transport. Breakthroughs in this area could lead to better performance in semiconductors used in satellites, 5G devices, and advanced radar systems, among other devices.

The epitaxial Si-Ge samples used in this research were grown at the U.S. Naval Research Lab. The TEM and EELS measurements were done at University of California, Irvine and Oak Ridge National Labs. The MD simulations were performed by the University of Notre Dame. The XRD study was done at UCLA. 

This work is financially supported by U.S. Office of Naval Research under a MURI project. The EELS study at UC Irvine is supported by U.S. Department of Energy. 

Citation: https://doi.org/10.1038/s41467-021-27250-3

About Georgia Institute of Technology

The Georgia Institute of Technology, or Georgia Tech, is a top 10 public research university developing leaders who advance technology and improve the human condition. The Institute offers business, computing, design, engineering, liberal arts, and sciences degrees. Its nearly 44,000 students representing 50 states and 149 countries, study at the main campus in Atlanta, at campuses in France and China, and through distance and online learning. As a leading technological university, Georgia Tech is an engine of economic development for Georgia, the Southeast, and the nation, conducting more than $1 billion in research annually for government, industry, and society.

Contact: 
Ben Wright 
Communications Manager
George W. Woodruff School of Mechanical Engineering
ben.wright@me.gatech.edu 
 

By Frida Carrera

 

On December 3, 2021, Startup Exchange presented the Fall 2021 Fellowship Pitch Competition sponsored by the Georgia Tech Student Innovation Program, Office of Undergraduate Education. The event took place at ATL Social Club in Tech Square, a major startup hub situated on Georgia Tech’s campus and perfect for those eager for innovation at GT. The event also welcomed partner companies and recruiters such as NCR and Stord. 

At this pitch-style event, six founder teams presented their innovative pitches and competed for first, second, and third place, each with a cash prize to aid in the advancement of their ideas. The first and second place winners of the competition were determined by three guest judges: Kathryn Petralia, co-founder of Kabbage and Drum; Thomas Suarez, co-founder of Teleport and Thiel Fellow; and Evan Jarecki, serial entrepreneur and BM at Startup Atlanta. The event commenced with a brief introduction by Startup Exchange executive board members, followed by presentations from the 6 teams including Fino, InSite, Jargon, and Tokenstack. After hearing each team’s pitch, the judges had time to deliberate and select the top two winners while the audience voted for the People’s Choice winner. Meanwhile, attendees were also able to hear from the partner companies and network while enjoying free perks such as food and beverages. 

“There are students everywhere across campus really starting on their start-ups and pursuing their dreams. Atlanta is a growing city and Georgia Tech is the perfect hub for that. These teams, we’re introducing them to entrepreneurship and giving those resources and intro-connections. By doing so, we’re inspiring them in a way. It’s just a great learning experience for them,” explained Startup Exchange’s Director of Fellowship Revanth Tiruveedhi.

Following the intermission, the judges presented the first-place award of $750 to Jargon, a browser extension that points out red flags in user contract agreements, as pitched by team members Kaleb Rasmussen and Devansh Khunteta. Second place of $500 was awarded to Eartheal by team members Colin Burnett, Philip Colt, Neal Austensen, and Brandon Sherrard. People's Choice of $250 was awarded to Tokenstack by team members Nitin Paul, Samrat Sahoo, Yatharth Bhargava, and Mohit Sahoo. The event then closed with remarks by Startup Exchange’s board members and photos with the participants.

To learn more about student innovation at Georgia Tech visit https://innovation.gatech.edu/  

 

 

With holiday shopping deadlines looming, consumers cannot escape the impact of the global microelectronic chip shortage. From daily news reports about manufacturers unable to complete orders due to the lack of chips, to “out of stock” messages across websites on popular electronics items, one of the impacts of COVID was to lay bare the massive importance of the microelectronic chip in daily modern life, and how a single-location centered manufacturing nexus can upend the consumer market on a massive scale. The combination of these real-world impacts on supply chains, as well as the need to localize semiconductor and chip manufacturing gave Congress the impetus to pass the “Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS)”. CHIPS seeks to increase investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.

The Georgia Institute of Technology was the first university to offer a comprehensive curriculum on microelectronics and microsystems design and packaging and, currently, numerous faculty at Georgia Tech are widely known for their work in semiconductor and microelectronics technologies. In December of 2021 Georgia Tech researchers will again showcase how their pushes the boundaries of microelectronics technologies at the IEEE International Electron Devices Meeting (IEDM).

The School of Electrical and Computer Engineering research teams of Assistant Professor Asif Khan, partnering with Dan Fielder Professor Muhannad Bakir, and Associate Professor Shimeng Yu, partnering with Professor Sung-Kyu Lim and Assistant Professor Shaolan Li, have dominated the 2021 IEDM presentation line-up with a total of 8 accepted papers. With topics ranging from ferroelectric materials for memory, new advances in ALD process, and in-memory computing and 3D reconfigurable architectures, the research presented by these teams is at the cutting-edge of advancing computing power and consumer electronics. In addition to the research presentations, Electrical and Computing Engineering Faculty & Director of the 3D Systems Packaging Research Center at GT will be presenting a short course session on devoted to “Heterogenous Integration Using Chiplets & Advanced Packaging”

Noting the timely nature of these research advancements, Arijit Raychowdhory; Professor and Steve W. Chaddick School Chair in Electrical and Computer Engineering noted, “IEDM is a premier conference in the area of semiconductor devices. Such a strong performance by GT ECE exemplifies the strength of our program, the ingenuity of our students and the innovation driven by our world-class faculty. Sincere congratulations to Professors Khan, Yu Bakir, Lim and Li for their pioneering research in semiconductor logic and memory technologies, that are critical for our nation and our industries.” 

Asif Khan is an assistant professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received his Ph.D. in electrical engineering and computer sciences from the University of California, Berkeley in 2015. His work led to the first experimental proof-of-concept demonstration of the negative capacitance effect in ferroelectric oxides. His group at Georgia Tech conceptualizes and fabricates electronic devices that leverage interesting physics and novel phenomena in emerging materials (such as ferroelectrics, antiferroelectrics and strongly correlated systems) to overcome the “fundamental” limits in computation and to address the most pressing challenges in electronics and the semiconductor industry.

Shimeng Yu is currently an associate professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received the B.S. degree in microelectronics from Peking University in 2009, and the M.S. degree and Ph.D. degree in electrical engineering from Stanford University in 2011 and 2013, respectively. From 2013 to 2018, he was an assistant professor at Arizona State University. Prof. Yu’s research interests are the semiconductor devices and integrated circuits for energy-efficient computing systems. His research expertise is on the emerging non-volatile memories for applications such as deep learning accelerator, in-memory computing, 3D integration, and hardware security.

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech.  Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), one from the IEEE Custom Integrated Circuits Conference (CICC), and two from the IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Muhannad S. Bakir received the B.E.E. degree from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Tech in 2000 and 2003, respectively. His research interests include, heterogeneous microsystem design and integration, including 2.5D and 3D ICs and packaging, electrical and photonic interconnects, and embedded cooling technologies.

Sung Kyu Lim received B.S. (1994), M.S. (1997), and Ph.D. (2000) degrees all from the Computer Science Department at UCLA. During 2000-2001, he was a post-doctoral scholar at UCLA, and a senior engineer at Aplus Design Technologies, Inc. Lim joined the School of Electrical and Computer Engineering at Georgia Institute of Technology an assistant professor. He is currently the director of the GTCAD (Georgia Tech Computer Aided Design) Laboratory and focuses on VLSI and 3D circuit architecture and packaging.

Shaolan Li received his B.Eng. degree with highest honor from the Hong Kong University of Science and Technology (HKUST) in 2012, and his Ph.D. from UT Austin in 2018, all in electrical engineering. Prior joining Georgia Tech as an assistant professor in 2019, he was a post-doctoral fellow in the Department of Electrical and Computer Engineering at UT Austin from 2018-2019. He also held intern positions in Broadcom Ltd. in Sunnyvale, California, and NXP in Tempe, Arizona during 2013-2014. His research interests are broadly in analog, mixed-signal, and RF integrated circuits. His expertise is in high-performance data converters, ultra-low-power low-cost sensor interface, and novel analog mixed-signal architectures for design automation.

The IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation. Georgia Tech research teams have a strong track of record in IEDM publications in the recent years, including 8, 4, 9 and 7 papers presented in IEDM 2018, 2019, 2020 and 2021, respectively.

 

- Christa M. Ernst