Georgia Institute of Technology is set to play a crucial role in a strategic effort funded by the Defense Advanced Research Project Agency (DARPA) to help bolster America’s national security and global military leadership.  

The project, led by the Texas Institute for Electronics (TIE) at The University of Texas at Austin, represents a total investment of $1.4 billion. The $840 million award from DARPA, announced by TIE in 2024, aims to develop the next generation of high-performing semiconductor microsystems for the Department of Defense (DoD). 

“We are honored to collaborate with TIE and its broader team on this far reaching and strategic program to enable best in class 3D heterogeneous integration (3DHI) processes and technologies in the United States,” said Muhannad S. Bakir, the Dan Fielder Professor in the School of Electrical and Computer Engineering and director of the 3D Systems Packaging Research Center, who is heading the project for Georgia Tech. 

3DHI is a semiconductor manufacturing process that incorporates different materials and components into microsystems with precision assembly. The use of 3DHI allows for the creation of high-performance, compact, and energy-efficient systems. 

The investment is part of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program comprised of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.

Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility. The facility will enable the DoD to create higher performance, lower power, lightweight, and compact defense systems. The advancements are expected to have wide-ranging applications, including radar, satellite imaging, and unmanned aerial vehicles.  

Georgia Tech will provide a wide range of expertise in 3DHI including design, fabrication and assembly processes, and characterization to support the NGMM national open-access R&D and prototyping facility at TIE.  

Regents' Professor and Morris M. Bryan, Jr. Professor Suresh K. Sitaraman in the George W. Woodruff School of Mechanical Engineering will be a key contributor to Georgia Tech’s efforts on the project.

“We are delighted to be partnering with UT/TIE on the establishment of a 3D Heterogeneous Integration Microsystem prototyping  facility,” said Sitaraman. “In addition to advancing fundamental science, this project is a great opportunity for Georgia Tech to demonstrate and integrate our ground-breaking and innovative 3DHI research approaches and technology solutions into TIE’s prototyping facility, and understand the challenges involved when translating lab-scale research work to a large industry-strength fabrication facility.” 

ECE Professors Saibal Mukhopadhyay, Arijit Raychowdhury, Visvesh Sathe, and Shimeng Yu will be working alongside Bakir and Sitaraman. 

A significant portion of the research will be conducted at the Institute for Matter and Systems (IMS), which operates Georgia Tech’s state-of-the-art electronics and nanotechnology core facilities. 

Read the press release from TIE and view the project’s team and partners.  

The Institute for Matter and Systems (IMS) has received $700,000 in funding from the National Science Foundation (NSF) for two education and outreach programs. 

The awards will support the Research Experience for Undergraduates (REU) and Research Experience for Teachers (RET) programs at Georgia Tech. The REU summer internship program provides undergraduate students from two- and four-year programs the chance to perform cutting-edge research at the forefront of nanoscale science and engineering. The RET program for high school teachers and technical college faculty offers a paid opportunity to experience the excitement of nanotechnology research and to share this experience in their classrooms. 

“This NSF funding allows us to be able to do more with the programs,” said Mikkel Thomas, associate director for education and outreach. “These are programs that have existed in the past, but we haven’t had external funding for the last three years. The NSF support allows us to do more —  bring more students into the program or increase the RET stipends.”

In addition to the REU and RET programs, IMS offers short courses and workshops focused on professional development, instructional labs for undergraduate and graduate students, a certificate for veterans in microelectronics and nano-manufacturing, and community engagement activities such as the Atlanta Science Festival. 

Georgia Tech researcher W. Hong Yeo has been awarded a $3 million grant to help develop a new generation of engineers and scientists in the field of sustainable medical devices. 

“The workforce that will emerge from this program will tackle a global challenge through sustainable innovations in device design and manufacturing,” said Yeo, Woodruff Faculty Fellow and associate professor in the George W. Woodruff School of Mechanical Engineering and the Wallace H. Coulter Department of Biomedical Engineering at Georgia Tech and Emory University.

The funding, from the National Science Foundation (NSF) Research Training (NRT) program, will address the environmental impacts resulting from the mass production of medical devices, including the increase in material waste and greenhouse gas emissions.

Under Yeo’s leadership, the Georgia Tech team comprises multidisciplinary faculty: Andrés García (bioengineering), HyunJoo Oh (industrial design and interactive computing), Lewis Wheaton (biology), and Josiah Hester (sustainable computing). Together, they’ll train 100 graduate students, including 25 NSF-funded trainees, who will develop reuseable, reliable medical devices for a range of uses. 

“We plan to educate students on how to develop medical devices using biocompatible and biodegradable materials and green manufacturing processes using low-cost printing technologies,” said Yeo. “These wearable and implantable devices will enhance disease diagnosis, therapeutics, rehabilitation, and health monitoring.”

Students in the program will be challenged by a comprehensive, multidisciplinary curriculum, with deep dives into bioengineering, public policy, physiology, industrial design, interactive computing, and medicine. And they’ll get real-world experience through collaborations with clinicians and medical product developers, working to create devices that meet the needs of patients and care providers.

The Georgia Tech NRT program aims to attract students from various backgrounds, fostering a diverse, inclusive environment in the classroom — and ultimately in the workforce.

The program will also introduce a new Ph.D. concentration in smart medical devices as part of Georgia Tech's bioengineering program, and a new M.S. program in the sustainable development of medical devices. Yeo also envisions an academic impact that extends beyond the Tech campus.

“Collectively, this NRT program's curriculum, combining methods from multiple domains, will help establish best practices in many higher education institutions for developing reliable and personalized medical devices for healthcare,” he said. “We’d like to broaden students' perspectives, move past the current technology-first mindset, and reflect the needs of patients and healthcare providers through sustainable technological solutions.” 

The National Science Foundation has awarded $2 million to Clark Atlanta University in partnership with the HBCU CHIPS Network, a collaborative effort involving historically black colleges and universities (HBCUs), government agencies, academia, and industry that will serve as a national resource for semiconductor research and education.

“This is an exciting time for the HBCU CHIPS Network,” said George White, senior director for Strategic Partnerships at Georgia Tech. “This funding, and the support of Georgia Tech Executive Vice President for Research Chaouki Abdallah, is integral for the successful launch of the CHIPS Network.” 

The HBCU Chips Network works to cultivate a diverse and skilled workforce that supports the national semiconductor industry. The student research and internship opportunities along with the development of specialized curricula in semiconductor design, fabrication, and related fields will expand the microelectronics workforce. As part of the network, Georgia Tech will optimize the packaging of chips into systems. 

Read the full story by Clark Atlanta University. 

Semiconductors make our world run, but the industry faces a turning point. For decades, computer chip efficiency has doubled every two years, but that progress is slowing. To complicate the problem further, global demand for semiconductors threatens to outpace the supply. The U.S. has the opportunity to meet the growing need for chips — both by increasing domestic manufacturing and building up the workforce, which is at its lowest in decades. To bolster semiconductor research and manufacturing, in 2022, Congress passed the $52.7 billion bipartisan CHIPS and Science Act that President Joe Biden signed into law. New paradigms and pioneers are needed to make these critical advances.

Georgia Tech is playing a significant role in creating the next generation of chips, as the Institute is especially well positioned to innovate in the semiconductor field. All areas of the semiconductor stack — the components that build a chip, from hardware to artificial intelligence — are studied at Tech, and collaboration among faculty is a hallmark of its research enterprise. Such cooperation is necessary to build better chips, since they need to be reinvented in every layer of the stack.

Read the full story on GT Research News.

Georgia Tech has been selected as one of six universities globally to receive funding for the newly established Global Industrial Technology Cooperation Center. The announcement was made by the Ministry of Trade, Industry, and Energy in South Korea during the Global Open Innovation Strategy Meeting in April.

The KIAT-Georgia Tech Semiconductor Electronics Center will receive $1.8 million to establish a sustainable semiconductor electronics research partnership between Korean companies, researchers, and Georgia Tech. 

“I am thrilled to announce that we have secured funding to launch a groundbreaking collaboration between Georgia Tech’s world-class researchers and Korean companies,” said Hong Yeo, associate professor and Woodruff Faculty Fellow in the George W. Woodruff School of Mechanical Engineering and the Wallace H. Coulter Department of Biomedical Engineering. “This initiative will drive the development of cutting-edge technologies to advance semiconductor, sensors, and electronics research.”

Yeo will lead the center, and Michael Filler, interim executive director for the Institute of Electronics and Nanotechnology, and Muhannad Bakir, director of the 3D Advanced Packaging Research Center, will serve as co-PIs.

The center will focus on advancing semiconductor research, a critical area of technology that forms the backbone of modern electronics.

The Cooperation Center is a global technology collaboration platform designed to facilitate international joint research and development planning, partner matching, and local support for domestic researchers. The selection of Georgia Tech underscores the Institute’s leadership and expertise in the field of semiconductors.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership. The proposed investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging. Started through a collaboration with the 3D Packaging Research Center at Georgia Tech, Absolics’ project serves as an example of American lab-to-fab development and production.

"Glass-core packaging holds the promise to revolutionize the field of advanced packaging and impact major paradigms such as artificial intelligence, mm-wave/THz communication, and photonic connectivity," said Muhannad Bakir, Dan Fielder Professor in the School of Electrical and Computer Engineering and Director of the 3D Systems Packaging Research Center at Georgia Tech.  "We look forward to supporting Absolics in establishing a glass-core packaging facility in the State of Georgia through workforce development initiatives." 

Because of President Biden’s CHIPS and Science Act, this proposed investment would support over an estimated 1,000 construction jobs and approximately 200 manufacturing and R&D jobs in Covington and enhance innovation capacity at Georgia Institute of Technology, supporting the local semiconductor talent pipeline. 

The proposed investment with Absolics is the first proposed CHIPS investment in a commercial facility supporting the semiconductor supply chain by manufacturing a new advanced material.

Read the full story

Effective July 1, Eric Vogel will become the executive director of the Institute for Matter and Systems (IMS), Georgia Tech’s newest Interdisciplinary Research Institute (IRI) that will launch on the same date.

As an evolution of the Institute for Materials (IMat) and the Institute for Electronics and Nanotechnology (IEN), IMS aims to enable convergent research at Georgia Tech related to the science, technology, and societal underpinnings of innovative materials and devices. Additionally, IMS seeks to integrate these innovations into systems that enhance human well-being and performance across information and communication, the built environment, and human-centric technologies that improve human health, wellness, and performance.

“Executive Vice President for Research Chaouki Abdallah and I are very excited about the launch of IMS, which positions Georgia Tech for integration of science and technology from atoms to devices, while explicitly drawing in researchers in the social sciences, design, business, and computing,” said Vice President of Interdisciplinary Research Julia Kubanek.

“IMS will ensure relevance across Georgia Tech through its newly configured Internal Advisor and Ambassador Board with representation across all six Colleges and GTRI,” she said. “Additional advisory committees representing IMS employees and facility users will ensure that we don’t sacrifice any of the research excellence for which IEN and IMat are known. With IMS I expect we will be even better positioned to tackle research problems that will have the greatest positive societal impact.”

Vogel will continue in his current position as the executive director of IMat until the launch of IMS. In addition to leading and growing IMat, Vogel is the Hightower Professor of Materials Science and Engineering at Georgia Tech’s School of Materials Science and Engineering, and he served as the IEN deputy director prior to leading IMat.

“It is an honor to be appointed executive director of the Institute for Matter and Systems, and I look forward to collaborating with the talented faculty and staff associated with it,” said Vogel. “This opportunity allows us to leverage the core competencies of IEN and IMat while extending our capabilities beyond nanotechnology and materials science. Together, we will be a hub for interdisciplinary research ranging from advanced materials to complex systems that solve global challenges.”

Georgia Tech’s IRIs facilitate collaboration between researchers and students from its six Colleges, the Georgia Tech Research Institute, national laboratories, and corporate entities to tackle critical topics of strategic significance for the Institute as well as for local, state, national, and international communities. IMS will also house and maintain the state-of-the-art Materials Characterization Facility and one of the largest academic cleanrooms in the nation, which offers a broad range of fabrication capabilities from basic discovery to prototype realization.

Before joining Georgia Tech in 2011, Vogel was an associate professor of materials science and engineering and electrical engineering at the University of Texas at Dallas. During this time, he also served as the associate director of the Texas Analog Center of Excellence and led UT Dallas’s involvement in the Southwest Academy for Nanoelectronics.

Prior to UT Dallas, he led the CMOS and Novel Devices Group and established the Nanofabrication Facility at the National Institute of Standards and Technology. Vogel holds a Ph.D. in electrical engineering from North Carolina State University and a B.S. in electrical engineering from the Pennsylvania State University. His research focuses on the development and fundamental understanding of electronic and nanomaterials and devices.