Georgia Tech professors Michelle LaPlaca and W. Hong Yeo have been selected as recipients of Peterson Professorships with the Children’s Healthcare of Atlanta Pediatric Technology Center (PTC) at Georgia Tech. The professorships, supported by the G.P. “Bud” Peterson and Valerie H. Peterson Faculty Endowment Fund, are meant to further energize the Georgia Tech and Children’s partnership by engaging and empowering researchers involved in pediatrics.

In a joint statement, PTC co-directors Wilbur Lam and Stanislav Emelianov said, “The appointment of Dr. LaPlaca and Dr. Yeo as Peterson Professors exemplifies the vision of Bud and Valerie Peterson — advancing innovation and collaboration through the Pediatric Technology Center to bring breakthrough ideas from the lab to the bedside, improving the lives of children and transforming healthcare.”

LaPlaca is a professor and associate chair for Faculty Development in the Department of Biomedical Engineering, a joint department between Georgia Tech and Emory University. Her research is focused on traumatic brain injury and concussion, concentrating on sources of heterogeneity and clinical translation. Specifically, she is working on biomarker discovery, the role of the glymphatic system, and novel virtual reality neurological assessments.    

“I am thrilled to be chosen as one of the Peterson Professors and appreciate Bud and Valerie Peterson’s dedication to pediatric research,” she said. “The professorship will allow me to broaden research in pediatric concussion assessment and college student concussion awareness, as well as to identify biomarkers in experimental models of brain injury.”

In addition to the research lab, LaPlaca will work with an undergraduate research class called Concussion Connect, which is part of the Vertically Integrated Projects program at Georgia Tech.

“Through the PTC, Georgia Tech and Children’s will positively impact brain health in Georgia’s pediatric population,” said LaPlaca.

Yeo is the Harris Saunders, Jr. Professor in the George W. Woodruff School of Mechanical Engineering and the director of the Wearable Intelligent Systems and Healthcare Center at Georgia Tech. His research focuses on nanomanufacturing and membrane electronics to develop soft biomedical devices aimed at improving disease diagnostics, therapeutics, and rehabilitation.

“I am truly honored to be awarded the Peterson Professorship from the Children’s PTC at Georgia Tech,” he said. “This recognition will greatly enhance my research efforts in developing soft bioelectronics aimed at advancing pediatric healthcare, as well as expand education opportunities for the next generation of undergraduate and graduate students interested in creating innovative medical devices that align seamlessly with the recent NSF Research Traineeship grant I received. I am eager to contribute to the dynamic partnership between Georgia Tech and Children’s Healthcare of Atlanta and to empower innovative solutions that will improve the lives of children.”

The Peterson Professorships honor the former Georgia Tech President and First Lady, whose vision for the importance of research in improving pediatric healthcare has had an enormous positive impact on the care of pediatric patients in our state and region.

The Children’s PTC at Georgia Tech brings clinical experts from Children’s together with Georgia Tech scientists and engineers to develop technological solutions to problems in the health and care of children. Children’s PTC provides extraordinary opportunities for interdisciplinary collaboration in pediatrics, creating breakthrough discoveries that often can only be found at the intersection of multiple disciplines. These collaborations also allow us to bring discoveries to the clinic and the bedside, thereby enhancing the lives of children and young adults. The mission of the PTC is to establish the world’s leading program in the development of technological solutions for children’s health, focused on three strategic areas that will have a lasting impact on Georgia’s kids and beyond.

The Institute for Matter and Systems (IMS) has received $700,000 in funding from the National Science Foundation (NSF) for two education and outreach programs. 

The awards will support the Research Experience for Undergraduates (REU) and Research Experience for Teachers (RET) programs at Georgia Tech. The REU summer internship program provides undergraduate students from two- and four-year programs the chance to perform cutting-edge research at the forefront of nanoscale science and engineering. The RET program for high school teachers and technical college faculty offers a paid opportunity to experience the excitement of nanotechnology research and to share this experience in their classrooms. 

“This NSF funding allows us to be able to do more with the programs,” said Mikkel Thomas, associate director for education and outreach. “These are programs that have existed in the past, but we haven’t had external funding for the last three years. The NSF support allows us to do more —  bring more students into the program or increase the RET stipends.”

In addition to the REU and RET programs, IMS offers short courses and workshops focused on professional development, instructional labs for undergraduate and graduate students, a certificate for veterans in microelectronics and nano-manufacturing, and community engagement activities such as the Atlanta Science Festival. 

The National Science Foundation has awarded $2 million to Clark Atlanta University in partnership with the HBCU CHIPS Network, a collaborative effort involving historically black colleges and universities (HBCUs), government agencies, academia, and industry that will serve as a national resource for semiconductor research and education.

“This is an exciting time for the HBCU CHIPS Network,” said George White, senior director for Strategic Partnerships at Georgia Tech. “This funding, and the support of Georgia Tech Executive Vice President for Research Chaouki Abdallah, is integral for the successful launch of the CHIPS Network.” 

The HBCU Chips Network works to cultivate a diverse and skilled workforce that supports the national semiconductor industry. The student research and internship opportunities along with the development of specialized curricula in semiconductor design, fabrication, and related fields will expand the microelectronics workforce. As part of the network, Georgia Tech will optimize the packaging of chips into systems. 

Read the full story by Clark Atlanta University. 

Semiconductors make our world run, but the industry faces a turning point. For decades, computer chip efficiency has doubled every two years, but that progress is slowing. To complicate the problem further, global demand for semiconductors threatens to outpace the supply. The U.S. has the opportunity to meet the growing need for chips — both by increasing domestic manufacturing and building up the workforce, which is at its lowest in decades. To bolster semiconductor research and manufacturing, in 2022, Congress passed the $52.7 billion bipartisan CHIPS and Science Act that President Joe Biden signed into law. New paradigms and pioneers are needed to make these critical advances.

Georgia Tech is playing a significant role in creating the next generation of chips, as the Institute is especially well positioned to innovate in the semiconductor field. All areas of the semiconductor stack — the components that build a chip, from hardware to artificial intelligence — are studied at Tech, and collaboration among faculty is a hallmark of its research enterprise. Such cooperation is necessary to build better chips, since they need to be reinvented in every layer of the stack.

Read the full story on GT Research News.

Georgia Tech has been selected as one of six universities globally to receive funding for the newly established Global Industrial Technology Cooperation Center. The announcement was made by the Ministry of Trade, Industry, and Energy in South Korea during the Global Open Innovation Strategy Meeting in April.

The KIAT-Georgia Tech Semiconductor Electronics Center will receive $1.8 million to establish a sustainable semiconductor electronics research partnership between Korean companies, researchers, and Georgia Tech. 

“I am thrilled to announce that we have secured funding to launch a groundbreaking collaboration between Georgia Tech’s world-class researchers and Korean companies,” said Hong Yeo, associate professor and Woodruff Faculty Fellow in the George W. Woodruff School of Mechanical Engineering and the Wallace H. Coulter Department of Biomedical Engineering. “This initiative will drive the development of cutting-edge technologies to advance semiconductor, sensors, and electronics research.”

Yeo will lead the center, and Michael Filler, interim executive director for the Institute of Electronics and Nanotechnology, and Muhannad Bakir, director of the 3D Advanced Packaging Research Center, will serve as co-PIs.

The center will focus on advancing semiconductor research, a critical area of technology that forms the backbone of modern electronics.

The Cooperation Center is a global technology collaboration platform designed to facilitate international joint research and development planning, partner matching, and local support for domestic researchers. The selection of Georgia Tech underscores the Institute’s leadership and expertise in the field of semiconductors.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership. The proposed investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging. Started through a collaboration with the 3D Packaging Research Center at Georgia Tech, Absolics’ project serves as an example of American lab-to-fab development and production.

"Glass-core packaging holds the promise to revolutionize the field of advanced packaging and impact major paradigms such as artificial intelligence, mm-wave/THz communication, and photonic connectivity," said Muhannad Bakir, Dan Fielder Professor in the School of Electrical and Computer Engineering and Director of the 3D Systems Packaging Research Center at Georgia Tech.  "We look forward to supporting Absolics in establishing a glass-core packaging facility in the State of Georgia through workforce development initiatives." 

Because of President Biden’s CHIPS and Science Act, this proposed investment would support over an estimated 1,000 construction jobs and approximately 200 manufacturing and R&D jobs in Covington and enhance innovation capacity at Georgia Institute of Technology, supporting the local semiconductor talent pipeline. 

The proposed investment with Absolics is the first proposed CHIPS investment in a commercial facility supporting the semiconductor supply chain by manufacturing a new advanced material.

Read the full story

Effective July 1, Eric Vogel will become the executive director of the Institute for Matter and Systems (IMS), Georgia Tech’s newest Interdisciplinary Research Institute (IRI) that will launch on the same date.

As an evolution of the Institute for Materials (IMat) and the Institute for Electronics and Nanotechnology (IEN), IMS aims to enable convergent research at Georgia Tech related to the science, technology, and societal underpinnings of innovative materials and devices. Additionally, IMS seeks to integrate these innovations into systems that enhance human well-being and performance across information and communication, the built environment, and human-centric technologies that improve human health, wellness, and performance.

“Executive Vice President for Research Chaouki Abdallah and I are very excited about the launch of IMS, which positions Georgia Tech for integration of science and technology from atoms to devices, while explicitly drawing in researchers in the social sciences, design, business, and computing,” said Vice President of Interdisciplinary Research Julia Kubanek.

“IMS will ensure relevance across Georgia Tech through its newly configured Internal Advisor and Ambassador Board with representation across all six Colleges and GTRI,” she said. “Additional advisory committees representing IMS employees and facility users will ensure that we don’t sacrifice any of the research excellence for which IEN and IMat are known. With IMS I expect we will be even better positioned to tackle research problems that will have the greatest positive societal impact.”

Vogel will continue in his current position as the executive director of IMat until the launch of IMS. In addition to leading and growing IMat, Vogel is the Hightower Professor of Materials Science and Engineering at Georgia Tech’s School of Materials Science and Engineering, and he served as the IEN deputy director prior to leading IMat.

“It is an honor to be appointed executive director of the Institute for Matter and Systems, and I look forward to collaborating with the talented faculty and staff associated with it,” said Vogel. “This opportunity allows us to leverage the core competencies of IEN and IMat while extending our capabilities beyond nanotechnology and materials science. Together, we will be a hub for interdisciplinary research ranging from advanced materials to complex systems that solve global challenges.”

Georgia Tech’s IRIs facilitate collaboration between researchers and students from its six Colleges, the Georgia Tech Research Institute, national laboratories, and corporate entities to tackle critical topics of strategic significance for the Institute as well as for local, state, national, and international communities. IMS will also house and maintain the state-of-the-art Materials Characterization Facility and one of the largest academic cleanrooms in the nation, which offers a broad range of fabrication capabilities from basic discovery to prototype realization.

Before joining Georgia Tech in 2011, Vogel was an associate professor of materials science and engineering and electrical engineering at the University of Texas at Dallas. During this time, he also served as the associate director of the Texas Analog Center of Excellence and led UT Dallas’s involvement in the Southwest Academy for Nanoelectronics.

Prior to UT Dallas, he led the CMOS and Novel Devices Group and established the Nanofabrication Facility at the National Institute of Standards and Technology. Vogel holds a Ph.D. in electrical engineering from North Carolina State University and a B.S. in electrical engineering from the Pennsylvania State University. His research focuses on the development and fundamental understanding of electronic and nanomaterials and devices.

Muhannad Bakir has been named director of the Institute for Electronics and Nanotechnology’s 3D Systems Packaging Research Center (PRC).

"We’re thrilled to have Professor Bakir joining us as the new director,” said Michael Filler, IEN’s interim executive director. “His wealth of experience and pioneering work in advanced packaging make him an excellent fit to lead the PRC into an exciting new era of innovation and technological impact.”

Originating as a National Science Foundation Engineering Research Center in 1993, the PRC is a national leader in the advanced packaging of microelectronics. Advanced packaging in microelectronics refers to innovative techniques for merging and interconnecting multiple components within a single electronic entity. This enables more powerful, efficient, and versatile microelectronic systems, driving innovation across various industries. The Center conducts research and education in all aspects of electronics packaging, including design, materials, process, assembly, thermal management, and system integration. Its work is driven by a wide range of applications, such as high-performance computing, artificial intelligence, automotive systems, wireless communications, and space exploration.

“I am honored for the opportunity to lead the PRC and look forward to working with the campus community and our industry, government, and academic partners on a research agenda that tackles the multifaceted challenges in advanced packaging and heterogeneous integration,” said Bakir.

As director, Bakir will guide the PRC into the future of advanced packaging through his vision and expertise. He is responsible for ensuring that the PRC's world-class facilities support the emerging needs of advanced packaging of microelectronics and supports members of the campus community who uses these facilities.

“We are excited to lead the science and engineering that culminates in system level prototyping and demonstrators for AI, mm-wave, photonic systems, and beyond,” he said.

Bakir, who also serves as the Dan Fielder Professor in the School of Electrical and Computer Engineering and leads the Integrated 3D Systems Group, brings a wealth of experience to his new role as PRC director. He and his research group have received more than 30 paper and presentation awards including seven from the IEEE Electronic Components and Technology Conference, four from the IEEE International Interconnect Technology Conference, and one from the IEEE Custom Integrated Circuits Conference. His group was also awarded the 2014 and 2017 Best Papers of the IEEE Transactions on Components Packaging and Manufacturing Technology.

Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. He is the co-recipient of the 2018 IEEE Electronics Packaging Society Exceptional Technical Achievement Award “for contributions to 2.5D and 3D IC heterogeneous integration, with a focus on interconnect technologies.” He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards. In 2020, Bakir received the Georgia Tech Outstanding Doctoral Thesis Advisor Award.

He serves as a senior area editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology and was previously an Editor for IEEE Transactions on Electron Devices. He has also served as a distinguished lecturer for IEEE EPS.

Learn more about PRC