Jan. 21, 2025
Georgia Institute of Technology is set to play a crucial role in a strategic effort funded by the Defense Advanced Research Project Agency (DARPA) to help bolster America’s national security and global military leadership.
The project, led by the Texas Institute for Electronics (TIE) at The University of Texas at Austin, represents a total investment of $1.4 billion. The $840 million award from DARPA, announced by TIE in 2024, aims to develop the next generation of high-performing semiconductor microsystems for the Department of Defense (DoD).
“We are honored to collaborate with TIE and its broader team on this far reaching and strategic program to enable best in class 3D heterogeneous integration (3DHI) processes and technologies in the United States,” said Muhannad S. Bakir, the Dan Fielder Professor in the School of Electrical and Computer Engineering and director of the 3D Systems Packaging Research Center, who is heading the project for Georgia Tech.
3DHI is a semiconductor manufacturing process that incorporates different materials and components into microsystems with precision assembly. The use of 3DHI allows for the creation of high-performance, compact, and energy-efficient systems.
The investment is part of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program comprised of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.
Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility. The facility will enable the DoD to create higher performance, lower power, lightweight, and compact defense systems. The advancements are expected to have wide-ranging applications, including radar, satellite imaging, and unmanned aerial vehicles.
Georgia Tech will provide a wide range of expertise in 3DHI including design, fabrication and assembly processes, and characterization to support the NGMM national open-access R&D and prototyping facility at TIE.
Regents' Professor and Morris M. Bryan, Jr. Professor Suresh K. Sitaraman in the George W. Woodruff School of Mechanical Engineering will be a key contributor to Georgia Tech’s efforts on the project.
“We are delighted to be partnering with UT/TIE on the establishment of a 3D Heterogeneous Integration Microsystem prototyping facility,” said Sitaraman. “In addition to advancing fundamental science, this project is a great opportunity for Georgia Tech to demonstrate and integrate our ground-breaking and innovative 3DHI research approaches and technology solutions into TIE’s prototyping facility, and understand the challenges involved when translating lab-scale research work to a large industry-strength fabrication facility.”
ECE Professors Saibal Mukhopadhyay, Arijit Raychowdhury, Visvesh Sathe, and Shimeng Yu will be working alongside Bakir and Sitaraman.
A significant portion of the research will be conducted at the Institute for Matter and Systems (IMS), which operates Georgia Tech’s state-of-the-art electronics and nanotechnology core facilities.
Read the press release from TIE and view the project’s team and partners.
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Dan Watson
Jan. 21, 2022
This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.
That includes making more of these chips here at home.
Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering. He also serves as director of the 3D Systems Packaging Research Center.
As an author of more than 450 technical publications who holds 29 patents, Swaminathan is one of the world’s leading experts on semiconductors and the semiconductor chips necessary for many of the devices we use every day to function.
“Almost any consumer device that is electronic tends to have at least one semiconductor chip in it,” Swaminathan explains. “The more complicated the functions any device performs, the more chips it is likely to have.”
Some of these semiconductor chips process information, some store data, and others provide sensing or communication functions.
In short, they are crucial in devices from video games and smart thermostats to cars and computers.
Our current shortage of these chips began with the Covid-19 pandemic. When consumers started staying at home and car purchases took a downward turn, chip manufacturers tried to shift to make more chips for other goods like smartphones and computers.
But Swaminathan explains that making that kind of switch is not simple. Entire production operations have to be changed. The chips are highly sensitive and can be damaged by static electricity, temperature variations, and even tiny specks of dust. The manufacturing environments must be highly regulated, and changes in the process can add months.
The pandemic highlighted another challenge with the semiconductor chip industry, according to Swaminathan.
“There’s a major shortage of companies making chips,” he says. “If you look worldwide, there are maybe four or five manufacturers making 80-90% of these chips and they are located outside of the United States.”
This creates supply chain hiccups with the raw supplies needed to make these chips as well. Add in the fact that many of these companies only design their chips – they don’t manufacture them directly.
“American consumers use 50% of the world’s chips,” Swaminathan says, which creates a serious challenge when the overwhelming majority of those chips are manufactured in other nations.
In the short term, the costs of the chip shortage is being passed on to the consumer. We see this directly with products like PlayStations and Xboxes that are more and more expensive and harder to purchase when the chips necessary for the consoles to function are in short supply.
Beyond 2022, Swaminathan says we need to work to revitalize the industry domestically.
“We need to bring more manufacturing back to the United States,” he says. “The U.S. government has recognized the importance of this semiconductor chip shortage and is trying to address the issue directly.”
That means investing in new plants to manufacture the chips, but America's journey toward chip self-sufficiency will continue to be a work in progress.
“This is a cycle,” Swaminathan explains. “But this is probably the first time where it has had such a major effect in so many different industries.”
But consumers can take direct action on their own in the coming year. “Reduce the number of times you purchase or upgrade electronic devices like phones and cars,” he says. “Then it becomes just a supply problem, not a demand and supply problem.”
Dec. 20, 2021
The world’s dependence on semiconductors came into sharp focus in 2021, when automotive manufacturing ground to a halt because of massive computer chip shortages – as Asian suppliers couldn’t keep up with demand for microelectronics – miniaturized electronic circuits and components that drive everything from smartphones to new vehicle components to hypersonics weapons systems.
The culprit was global supply chain disruptions caused by the Covid-19 pandemic. The crisis has highlighted the pressing need for the U.S. to bolster its domestic semiconductor supply chains and industrial capacity, after three decades of decline as a semiconductor producer. The U.S. share of global semiconductor fabrication has dropped to 12% today, compared to 37% in 1990, according to the Semiconductor Industry Association (SIA). In addition, the semiconductor industry today only accounts for 250,000 direct U.S. jobs.
As the country rebuilds its semiconductor infrastructure at home, Georgia Tech serves as a vital partner – to train the microelectronics workforce, drive future microelectronics advances, and provide unique fabrication and packaging facilities for industry, academic and government partners to develop and test new solutions.
“We’re one of the only universities that can support the whole microelectronics stack – from new materials and devices to packaging and systems,” said Madhavan Swaminathan, the John Pippin Chair in Microsystems Packaging in the School of Electrical and Computer Engineering and director of the 3D Systems Packaging Research Center.
Dec. 03, 2021
With holiday shopping deadlines looming, consumers cannot escape the impact of the global microelectronic chip shortage. From daily news reports about manufacturers unable to complete orders due to the lack of chips, to “out of stock” messages across websites on popular electronics items, one of the impacts of COVID was to lay bare the massive importance of the microelectronic chip in daily modern life, and how a single-location centered manufacturing nexus can upend the consumer market on a massive scale. The combination of these real-world impacts on supply chains, as well as the need to localize semiconductor and chip manufacturing gave Congress the impetus to pass the “Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS)”. CHIPS seeks to increase investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.
The Georgia Institute of Technology was the first university to offer a comprehensive curriculum on microelectronics and microsystems design and packaging and, currently, numerous faculty at Georgia Tech are widely known for their work in semiconductor and microelectronics technologies. In December of 2021 Georgia Tech researchers will again showcase how their pushes the boundaries of microelectronics technologies at the IEEE International Electron Devices Meeting (IEDM).
The School of Electrical and Computer Engineering research teams of Assistant Professor Asif Khan, partnering with Dan Fielder Professor Muhannad Bakir, and Associate Professor Shimeng Yu, partnering with Professor Sung-Kyu Lim and Assistant Professor Shaolan Li, have dominated the 2021 IEDM presentation line-up with a total of 8 accepted papers. With topics ranging from ferroelectric materials for memory, new advances in ALD process, and in-memory computing and 3D reconfigurable architectures, the research presented by these teams is at the cutting-edge of advancing computing power and consumer electronics. In addition to the research presentations, Electrical and Computing Engineering Faculty & Director of the 3D Systems Packaging Research Center at GT will be presenting a short course session on devoted to “Heterogenous Integration Using Chiplets & Advanced Packaging”
Noting the timely nature of these research advancements, Arijit Raychowdhory; Professor and Steve W. Chaddick School Chair in Electrical and Computer Engineering noted, “IEDM is a premier conference in the area of semiconductor devices. Such a strong performance by GT ECE exemplifies the strength of our program, the ingenuity of our students and the innovation driven by our world-class faculty. Sincere congratulations to Professors Khan, Yu Bakir, Lim and Li for their pioneering research in semiconductor logic and memory technologies, that are critical for our nation and our industries.”
Asif Khan is an assistant professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received his Ph.D. in electrical engineering and computer sciences from the University of California, Berkeley in 2015. His work led to the first experimental proof-of-concept demonstration of the negative capacitance effect in ferroelectric oxides. His group at Georgia Tech conceptualizes and fabricates electronic devices that leverage interesting physics and novel phenomena in emerging materials (such as ferroelectrics, antiferroelectrics and strongly correlated systems) to overcome the “fundamental” limits in computation and to address the most pressing challenges in electronics and the semiconductor industry.
Shimeng Yu is currently an associate professor in the School of Electrical and Computer Engineering at the Georgia Tech. He received the B.S. degree in microelectronics from Peking University in 2009, and the M.S. degree and Ph.D. degree in electrical engineering from Stanford University in 2011 and 2013, respectively. From 2013 to 2018, he was an assistant professor at Arizona State University. Prof. Yu’s research interests are the semiconductor devices and integrated circuits for energy-efficient computing systems. His research expertise is on the emerging non-volatile memories for applications such as deep learning accelerator, in-memory computing, 3D integration, and hardware security.
Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech. Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), one from the IEEE Custom Integrated Circuits Conference (CICC), and two from the IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Muhannad S. Bakir received the B.E.E. degree from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Tech in 2000 and 2003, respectively. His research interests include, heterogeneous microsystem design and integration, including 2.5D and 3D ICs and packaging, electrical and photonic interconnects, and embedded cooling technologies.
Sung Kyu Lim received B.S. (1994), M.S. (1997), and Ph.D. (2000) degrees all from the Computer Science Department at UCLA. During 2000-2001, he was a post-doctoral scholar at UCLA, and a senior engineer at Aplus Design Technologies, Inc. Lim joined the School of Electrical and Computer Engineering at Georgia Institute of Technology an assistant professor. He is currently the director of the GTCAD (Georgia Tech Computer Aided Design) Laboratory and focuses on VLSI and 3D circuit architecture and packaging.
Shaolan Li received his B.Eng. degree with highest honor from the Hong Kong University of Science and Technology (HKUST) in 2012, and his Ph.D. from UT Austin in 2018, all in electrical engineering. Prior joining Georgia Tech as an assistant professor in 2019, he was a post-doctoral fellow in the Department of Electrical and Computer Engineering at UT Austin from 2018-2019. He also held intern positions in Broadcom Ltd. in Sunnyvale, California, and NXP in Tempe, Arizona during 2013-2014. His research interests are broadly in analog, mixed-signal, and RF integrated circuits. His expertise is in high-performance data converters, ultra-low-power low-cost sensor interface, and novel analog mixed-signal architectures for design automation.
The IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation. Georgia Tech research teams have a strong track of record in IEDM publications in the recent years, including 8, 4, 9 and 7 papers presented in IEDM 2018, 2019, 2020 and 2021, respectively.
- Christa M. Ernst
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Christa M. Ernst - Interdisciplinary Research Communications Program Manager
Topics: Materials | Nanotechnology | Robotics
Georgia Institute of Technology| christa.ernst@research.gatech.edu