May. 23, 2024
The Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership. The proposed investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging. Started through a collaboration with the 3D Packaging Research Center at Georgia Tech, Absolics’ project serves as an example of American lab-to-fab development and production.
"Glass-core packaging holds the promise to revolutionize the field of advanced packaging and impact major paradigms such as artificial intelligence, mm-wave/THz communication, and photonic connectivity," said Muhannad Bakir, Dan Fielder Professor in the School of Electrical and Computer Engineering and Director of the 3D Systems Packaging Research Center at Georgia Tech. "We look forward to supporting Absolics in establishing a glass-core packaging facility in the State of Georgia through workforce development initiatives."
Because of President Biden’s CHIPS and Science Act, this proposed investment would support over an estimated 1,000 construction jobs and approximately 200 manufacturing and R&D jobs in Covington and enhance innovation capacity at Georgia Institute of Technology, supporting the local semiconductor talent pipeline.
The proposed investment with Absolics is the first proposed CHIPS investment in a commercial facility supporting the semiconductor supply chain by manufacturing a new advanced material.
