Mar. 13, 2024
Muhannad Bakir has been named director of the Institute for Electronics and Nanotechnology’s 3D Systems Packaging Research Center (PRC).
"We’re thrilled to have Professor Bakir joining us as the new director,” said Michael Filler, IEN’s interim executive director. “His wealth of experience and pioneering work in advanced packaging make him an excellent fit to lead the PRC into an exciting new era of innovation and technological impact.”
Originating as a National Science Foundation Engineering Research Center in 1993, the PRC is a national leader in the advanced packaging of microelectronics. Advanced packaging in microelectronics refers to innovative techniques for merging and interconnecting multiple components within a single electronic entity. This enables more powerful, efficient, and versatile microelectronic systems, driving innovation across various industries. The Center conducts research and education in all aspects of electronics packaging, including design, materials, process, assembly, thermal management, and system integration. Its work is driven by a wide range of applications, such as high-performance computing, artificial intelligence, automotive systems, wireless communications, and space exploration.
“I am honored for the opportunity to lead the PRC and look forward to working with the campus community and our industry, government, and academic partners on a research agenda that tackles the multifaceted challenges in advanced packaging and heterogeneous integration,” said Bakir.
As director, Bakir will guide the PRC into the future of advanced packaging through his vision and expertise. He is responsible for ensuring that the PRC's world-class facilities support the emerging needs of advanced packaging of microelectronics and supports members of the campus community who uses these facilities.
“We are excited to lead the science and engineering that culminates in system level prototyping and demonstrators for AI, mm-wave, photonic systems, and beyond,” he said.
Bakir, who also serves as the Dan Fielder Professor in the School of Electrical and Computer Engineering and leads the Integrated 3D Systems Group, brings a wealth of experience to his new role as PRC director. He and his research group have received more than 30 paper and presentation awards including seven from the IEEE Electronic Components and Technology Conference, four from the IEEE International Interconnect Technology Conference, and one from the IEEE Custom Integrated Circuits Conference. His group was also awarded the 2014 and 2017 Best Papers of the IEEE Transactions on Components Packaging and Manufacturing Technology.
Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. He is the co-recipient of the 2018 IEEE Electronics Packaging Society Exceptional Technical Achievement Award “for contributions to 2.5D and 3D IC heterogeneous integration, with a focus on interconnect technologies.” He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards. In 2020, Bakir received the Georgia Tech Outstanding Doctoral Thesis Advisor Award.
He serves as a senior area editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology and was previously an Editor for IEEE Transactions on Electron Devices. He has also served as a distinguished lecturer for IEEE EPS.
