The Georgia Institute of Technology will receive up to $2 million to research advanced semiconductor packaging technologies. Georgia Tech was selected as a partner institution by the South Korean Ministry of Trade. 

The Institute for Matter and Systems (IMS), George W. Woodruff School of Mechanical Engineering, and the 3D Systems Packaging Research Center (PRC) will work with Myongji University and industry partners in South Korea on a seven-year collaborative project that focuses on developing core evaluation technologies for advanced semiconductor packaging. 

The project is led by Seung-Joon Paik, IMS research engineer; Yongwon Lee, research engineer in the George W. Woodruff School of Mechanical Engineering; and Kyong-Sik “Jack” Moon, PRC research engineer. It is funded by the Korea Planning & Evaluation Institute of Industrial Technology of the Ministry of Trade, Industry and Energy in Korea.

The project aims to develop validation technologies for next-generation 3D packaging with strategic globally competitive capabilities. The developed platform will meet the high growing demand for advanced packaging technologies for artificial intelligence, high-performance computing, and chiplet-based semiconductor. As a designated partner, Georgia Tech will play a pivotal role in developing core evaluation technologies. 

The project’s outcomes will contribute to the commercialization of dependable packaging technologies and the resilience of the global semiconductor supply chain.